Senior Solutions Architect, Package Substrate EDA
About The Position
Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. You have spent years deep in the physical design and automation challenges of package substrate products, and you understand how to deliver solutions that work at scale. You have delivered production substrate design methodologies that integrate signal and power integrity requirements. You have built working relationships with foundry and OSAT partners. You think architecturally and can understand and resolve challenges across the data model, implementation engine, DRC engine, or manufacturing readiness. You have demonstrated leadership and direction setting for R&D teams. You can interact with a GM or a customer's most senior technologist because you understand and have solved the hard problems before. You are comfortable with ambiguity at the front end of a project but are able to drive toward clarity fast. At Synopsys, you will help shape the future of 3DIC and package substrate tooling, working with the executive R&D owner for 3DIC and influencing product strategy that affects how the industry designs the next generation of advanced packages.
Requirements
- Deep hands-on experience in package substrate design automation, including physical design, auto routing, DRC, power delivery network analysis, and design-for-manufacturing
- Strong programming skills in C++, Python, and TCL, with a track record of building production-quality EDA software
- Proven experience leading R&D projects that resulted in new architectural solutions, not just feature development or flow integration
- Extensive knowledge of computational geometry algorithms and their application to physical design automation problems
- Understanding of schematic-driven layout methodologies for package designs and the data models that connect electrical and physical domains
- Experience working directly with foundries and assembly and test companies to implement new package substrate technologies and translate manufacturing requirements into design automation
- Bachelor's or Master's degree in Computer Science, Electrical Engineering, or a related field, or equivalent practical experience
Nice To Haves
- Familiarity with design rule manuals, technology files, and ODB++ output formats for substrate manufacturing and design validation is a strong plus
Responsibilities
- Lead R&D projects defining the architectural direction for package substrate design automation, including auto routing, power delivery network analysis, DRC engines, and database models
- Drive new technical solutions beyond incremental features, working directly with the Exec Director R&D owner for 3DIC to influence product roadmap and strategic direction
- Develop and optimize EDA software in C++, Python, and TCL to solve computational geometry and physical design automation challenges at scale
- Collaborate with cross-functional teams on database models, collateral input/output formats like ODB++, and integration with analysis tools for design validation
- Partner directly with foundries and assembly and test companies to implement emerging package substrate technologies and design methodologies, translating manufacturing constraints into tooling requirements
- Provide technical mentorship and architectural guidance to engineering teams, raising the technical bar across substrate design automation projects
- Communicate complex technical tradeoffs and architectural decisions to senior internal leaders and customer technologists, shaping how Synopsys and the industry approach advanced packaging challenges
Benefits
- annual bonus
- equity
- other discretionary bonuses
- comprehensive health, wellness, and financial benefits
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What This Job Offers
Job Type
Full-time
Career Level
Senior
