Senior Process Engineer – Substrate

Syenta • Tempe, AZ

2d

About The Position

About the Role We are seeking a Senior Process Engineer (Substrate) to support the development of Syenta’s advanced packaging toolset. In this hands-on role, you will develop critical components of the toolset, focusing on process development of (1) Photo Imageable Dielectric (PID) coating and patterning of precise, fine-line circuitry, and (2) Wafer Level Processing, including photolithography, etching, thin film deposition, wet processing, and metrology verification. You will work across substrate build-up processes, general microfabrication, and characterization, contributing directly to the development of next-generation device production processes and helping translate prototypes into scalable manufacturing solutions.

Requirements

• Bachelor’s degree in physics, Chemistry, Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
• Minimum 7 years of combined experience in microfabrication processes with demonstrated cleanroom proficiency from either an academic or industry background, and the ability to support seamless process integration
• Hands-on experience with commonly used photoresist coating, exposure, and development tools and processes.
• Knowledge of PID materials for interposer buildup.
• Experience with etching processes (ICP, RIE, CCP, and wet etching)
• Experience in metallization and thin-film deposition (PECVD, PVD, etc.)
• Experience working in semiconductor-grade cleanroom environments

Nice To Haves

• Master’s or PhD in Physics, Chemistry, Materials Science, Electrical Engineering, Mechanical Engineering, or a related field
• 10+ years of combined experience in microfabrication processes with demonstrated cleanroom proficiency from either an academic or industry background
• Experience in the semiconductor industry, particularly in advanced packaging or interposer/substrate build-up

Responsibilities

• Develop and optimize Photo Imageable Dielectric (PID) and light-sensitive insulating material processes (e.g., PV-FX2 HR200) for advanced semiconductor packaging and fine-line circuit patterning
• Drive multi-layer build-up process development and support translation of prototype processes into scalable, high-yield manufacturing solutions for advanced packaging
• Execute microfabrication processes including photolithography, etching, thin film deposition, wet processing, and metrology verification (e.g., developing tool- and material-specific recipes)
• Troubleshoot microfabrication defects
• Collaborate closely with Sydney team
• Ensure documentation is clear and thorough
• Work closely with materials scientists, chemists, and engineers to deliver prototypes and an integrated product
• Support transfer of developed processes to national and international commercial fabs
• Ensure clear, timely, and well-documented engagement with external suppliers
• Perform metrology and inspection to assess process quality and reproducibility
• Analyze experimental data and translate findings into process improvements
• Basic reliability testing literacy in TCT, HAST, MSL.
• Explore new lithography and fabrication techniques to improve resolution and performance
• Contribute to continuous improvement of fabrication workflows and process capability

Benefits

• Early-stage equity opportunities
• Potential 401(k) and other benefits
• Comprehensive health, dental, and vision coverage plans, supported by Company
• Professional Growth – We’re scaling fast, so responsibilities can expand significantly in tandem with the business
• Team Events – Annual company event in Australia to collaborate and celebrate
• Work-Life Balance – An understanding that meaningful work can coexist with a fulfilling personal life
• 15 days PTO and 10 days sick leave

What This Job Offers

• Job Type: Full-time
• Career Level: Senior