Senior Principal Optical Integration Engineer

Coherent • Fremont, CA

12d • Onsite

About The Position

Drive Co-Packaged Optics and Optical Engine product packaging activities from initial concept to production. Develop Silicon Photonic (PIC) and electronics IC (EIC) co-design process flow, PIC and EIC IO pad frame and 3D interposer floor plan. Lead PIC and EIC interconnect schematic and monitor layout design process. Work with OSAT’s to define PIC and EIC hybrid integration packaging design rules, process flow, and material sets. Lead optical package development to establish package manufacturability and reliability. Collaborate with cross-functional teams consisting of laser packaging, Silicon Photonics, IC design, substrate layout, and module design teams.

Requirements

• MS/PhD in an engineering or science discipline plus 5+ years of relevant experience
• Experience with semiconductor laser design and silicon photonics.
• Experience of managing cross-functional teams successfully, interacting with a broad range of functions, skills, cultures, and personalities.
• Previous experience as an engineer in laser and silicon photonics R&D.
• In-depth understanding of all aspects of Silicon Photonics.
• Familiarity of high speed modulation in Silicon photonics including MZM, MRM, EAM at 200G and 400G.
• Strong problem solving, critical thinking, and risk management skills.
• Strong communication, planning, and organizational skills.
• Highly self-motivated with a strong multi-disciplinary background is essential.

Nice To Haves

• Experience with CPO, optical transceivers or components desirable.
• Experience with New Product Introduction (NPI) and/or Product Lifecycle Management processes

Responsibilities

• Drive Co-Packaged Optics and Optical Engine product packaging activities from initial concept to production.
• Develop Silicon Photonic (PIC) and electronics IC (EIC) co-design process flow, PIC and EIC IO pad frame and 3D interposer floor plan.
• Lead PIC and EIC interconnect schematic and monitor layout design process.
• Work with OSAT’s to define PIC and EIC hybrid integration packaging design rules, process flow, and material sets.
• Lead optical package development to establish package manufacturability and reliability.
• Collaborate with cross-functional teams consisting of laser packaging, Silicon Photonics, IC design, substrate layout, and module design teams.

Benefits

• All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior