Senior PCB Engineer

NVIDIA•Santa Clara, CA

1d•$176,000 - $276,000

About The Position

NVIDIA is seeking an experienced Printed Circuits Board (PCB) Material Science Subject Matter Expert (SME) to join their team. As a seasoned professional with a strong background in material science, chemistry, and engineering, you will provide expert guidance and support to their engineering team and suppliers. This role involves leading research, development, and implementation of high-volume manufacturing of high layer count PCBs, and researching new PCB technologies, interconnect structures, and materials for new products, performance improvements, and cost reductions. The position also requires owning the development of PCB technology and material roadmaps, providing PCB technology support to various engineering teams, and developing strong relationships with PCB manufacturers and laminate material suppliers. Additionally, the role involves defining and optimizing PCB stack-ups for reliability and cost-effectiveness, and leading engagement with the PCB supply base to ensure capability and readiness.

Requirements

BS or MS in Chemistry, Materials Engineering, or a related field (or equivalent experience), with 12+ years of experience in PCB design, fabrication, and materials.
OEM system-level PCB and backplane experience is highly desirable.
Extensive expertise across PCB technologies, with a strong background in R&D of laminate materials, PCB interconnect structures, related chemistries, and fabrication processes.
Deep understanding of the PCB supplier base and raw material sourcing ecosystem.
Proven expertise in HDI, high-layer-count PCBs, materials, and signal-integrity challenges for high-speed (25 Gbps+) designs.
Demonstrated ability to work and communicate effectively with hardware and signal integrity engineering teams, and to build strong, trusted cross-functional relationships.
Self-starter who can operate with minimal supervision.
Strong leadership and verbal/written communication skills.

Nice To Haves

Experience with Transient Liquid Phase Sintering (TLPS) Technology or Polytetrafluoropolmer (PTFE) Materials is preferred.

Responsibilities

Lead research, development and implementation of high-volume manufacturing of high layer count PCBs.
Lead research and development of new PCB technologies, interconnect structures, and materials required for new products, product performance improvements, and cost reductions, ahead of engineering demand.
Own the development of PCB technology and material roadmaps based on engineering requirements and next-generation product needs.
Provide PCB technology support to Engineering Teams, Signal Integrity, PCB Design, PCB Sourcing, and Operations Engineering teams.
Develop and maintain strong relationships with PCB manufacturers and laminate material suppliers supporting NVIDIA PCB designs.
Define and optimize PCB stack-ups to maximize reliability while incorporating cost-avoidance strategies.
Lead engagement with the PCB supply base to ensure capability and readiness to meet roadmap requirements and qualify suppliers for new technologies and materials.