Senior PCB Designer (RF Layout) - #26-26837

USTech Solutions•Lansdale, PA

About The Position

We are seeking an experienced Senior PCB Designer with strong RF layout expertise to join the engineering team. The role focuses on designing complex, high-speed, multi-layer PCBs for mission-critical applications, preferably in the defense or aerospace industry. It requires technical knowledge of RF design principles, signal integrity, and industry compliance standards, as well as proficiency in Altium Designer, Siemens Xpedition (Mentor), and Cadence Allegro. The designer will work with RF, hardware, mechanical, and manufacturing engineers throughout the product lifecycle; create fabrication and assembly documentation; support prototype bring-up, testing, and debugging; and coordinate with PCB fabricators and contract manufacturing partners on DFM/DFT issues. The position also includes participation in design reviews and technical leadership and mentorship for junior designers. The role is offered for a duration of three months. The position description lists an associate’s or bachelor’s degree in Electrical Engineering, Electronics Technology, or a related field, or equivalent experience. The employer describes opportunities to work on RF and mission-critical defense technologies in a collaborative engineering culture, with competitive compensation and benefits.

Requirements

At least 8 years of professional PCB design experience.
Extensive RF layout experience; GHz-range designs are preferred.
Strong proficiency in Altium Designer, Siemens Xpedition (Mentor Graphics), and Cadence Allegro PCB Designer.
Experience with high-layer-count boards; 10 or more layers are preferred.
Deep understanding of controlled-impedance routing, differential-pair routing, crosstalk mitigation, return-path management, and grounding and shielding strategies.
Experience with high-speed interfaces such as SERDES, DDR, PCIe, and Ethernet.
Familiarity with stack-up design and material selection for RF performance.
Working knowledge of signal integrity and power integrity analysis tools.
Strong problem-solving and analytical skills.
Excellent communication and cross-functional collaboration abilities.
Detail-oriented, with strong documentation discipline.
Ability to manage multiple projects in a fast-paced, regulated environment.
Leadership mindset and ability to mentor.
Associate’s or bachelor’s degree in Electrical Engineering, Electronics Technology, or a related field, or equivalent experience.

Nice To Haves

Experience in the defense, aerospace, or military electronics industry.
Familiarity with MIL-STD requirements and ITAR-controlled environments.
Experience designing for harsh environments, including temperature, vibration, and shock.
Active or eligible security clearance.
Experience with simulation tools such as HFSS, ADS, or HyperLynx.
IPC CID or CID+ certification.
Experience with GHz-range RF designs.
Experience with boards with 10 or more layers.

Responsibilities

Design and develop complex, multi-layer PCBs, including rigid, flex, and rigid-flex boards, for RF and high-speed digital applications.
Perform RF layout for controlled-impedance structures, transmission lines, antennas, filters, LNAs, PAs, and mixed-signal designs.
Apply best practices for signal integrity, power integrity, EMI/EMC mitigation, and thermal management.
Collaborate with RF, hardware, mechanical, and manufacturing engineers throughout the product lifecycle.
Create and maintain PCB libraries, stack-ups, and design rules.
Generate fabrication and assembly documentation packages.
Support prototype bring-up, testing, and debugging activities.
Ensure compliance with IPC standards and defense-related requirements.
Interface with PCB fabricators and contract manufacturing partners to resolve DFM/DFT issues.
Participate in design reviews and provide technical leadership and mentorship to junior designers.