Senior Package Layout Engineer - Hardware

NVIDIA•Us, CA

1d•Hybrid

About The Position

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions! This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.

Requirements

B.S. Electrical Engineering or equivalent experience
5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology.
Proven experience in substrate layout of wire bond and flip chip packages, preferred
Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
Solid understanding of high-speed design signal integrity practices

Nice To Haves

Experience with HDI designs is a plus
Experience with Virtuoso and Calibre is a plus
Experience using Valor is helpful

Responsibilities

Collaborate to implement high speed/density ASIC packages.
Perform substrate breakout patterns for ASIC packages.
Optimize package pinout incorporating system level trade-offs of pins assignment.
Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
Develop symbols and CAD library databases using Cadence APD design tools
Develop methodologies to improve layout productivity