Substrate/Package Layout Engineer

Broadcom•San Jose, CA

About The Position

Broadcom OSD is seeking an IC Substrate and Package/Interposer Layout Engineer. This role involves primary responsibility for the layout, routing, and functionality of packages and substrates, including the design of high-speed lines. The engineer will be required to have expertise with design tools such as Calibre/Klayout and Cadence tools (e.g., Allegro Package Design, Innovus, and Virtuoso). Collaboration with other core members of the design team, mechanical engineers, electrical engineers, power/signal integrity engineers, and project managers is essential. The position also includes conducting peer reviews of substrate/package designs and working with substrate/package vendors to define layout/panel/stack-up design and other specifications. Beyond front-end layout, the engineer will assist in evaluating parts post-fabrication, which includes visual inspection, electrical functionality, and characterization of high-speed electrical lines.

Requirements

Bachelors degree in Material Science/ Electrical/ Computer/Mechanical Engineering or related science/engineering degree with at least 12 years experience.
Or Masters degree and 10+ years of related experience or PhD and 7+ years of related experience
Deep knowledge and expertise with using Cadence layout tools and Electronic Design Automation (EDA) tools.
Broad understanding of multilayer high speed rf-design, package/substrate manufacturing processes and materials, and surface mount technology
Simulations of designs and improvement suggestions.

Responsibilities

Design and layout advanced substrates and IC packages
Develop and utilize a script-based layout tools.
Collaborate with design and verification teams to ensure layout meets specifications and performance requirements.
Perform design rule checking (DRC) and layout vs schematic (LVS) check.
Contribute to the development and improvement of layout methodologies and flows