About The Position

The Teradyne Innovation Lab is an advanced R&D team within the Semiconductor Test Division. It explores new technologies and architectures to create differentiated solutions for Teradyne’s core semiconductor test business and develops solutions for adjacent business opportunities. The Senior Microwave R&D Engineer will help define methods for characterizing and validating integrated circuits operating from RF through sub-THz frequencies, including devices with wide modulation bandwidths. The role focuses on pathfinding design and development of sub-THz instrumentation for next-generation communication and sensing ICs, as well as over-the-air (OTA) hardware and test methodologies for highly integrated mm-wave and sub-THz devices. The engineer will rapidly prototype and validate designs using simulation and measurement, then help transition advanced microwave subsystems from the lab into Teradyne’s automated test equipment portfolio.

Requirements

  • Master’s degree or equivalent experience in Electrical Engineering, Physics, or a related field.
  • At least 10 years of hands-on microwave design and development above 10 GHz.
  • Proficiency with ADS, HFSS, Cadence, or Microwave Office, and with VNAs, spectrum analyzers, and related measurement equipment.
  • Software development skills in MATLAB and Python for modeling, automation, and data analysis.
  • Command of PCB layout rules for signal integrity above 10 GHz.
  • Familiarity with beamforming, phased-array antennas, mm-wave packaging, and signal processing for radar and sensing applications.
  • Strong analytical thinking and an innovative mindset, with the ability to thrive in ambiguity and adapt quickly when problems change.

Nice To Haves

  • PhD degree.
  • Experience in waveguide and antenna design, characterization, and OTA measurement, such as compact range, near-field, or anechoic chamber testing.

Responsibilities

  • Support pathfinding design and development of sub-THz instrumentation for next-generation communication and sensing ICs.
  • Develop over-the-air hardware and test methodologies for highly integrated mm-wave and sub-THz devices, including antenna-in-package and phased-array chipsets.
  • Build and iterate on prototypes in rapid cycles, validating performance through simulation, measurement, and refinement.
  • Help transition advanced microwave subsystems from the lab into Teradyne’s automated test equipment portfolio, taking designs from prototype to product.

Benefits

  • Medical insurance
  • Dental insurance
  • Vision insurance
  • Flexible Spending Accounts
  • Retirement savings plans
  • Life insurance
  • Disability insurance
  • Paid vacation
  • Paid holidays
  • Tuition assistance programs
  • Discretionary bonuses based on financial performance
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