Senior Specialist, Senior Microelectronics Failure Analysis Engineer

L3Harris • Palm Bay, FL

4d • Onsite

About The Position

L3Harris is seeking a Senior Specialist, Microelectronics Failure Analysis Engineer to investigate component failures and provide actionable insights that improve product quality and reliability. The role leads investigations of microelectronic components and circuit-level assemblies that fail during manufacturing, qualification, testing, or field operation. The engineer develops investigative plans, performs hands-on electrical and physical analysis, and interprets evidence to identify failure mechanisms and establish root cause.

The work uses techniques including optical microscopy, X-ray inspection, cross-sectioning, scanning electron microscopy (SEM), photoemission microscopy, electrical testing, decapsulation, and delayering. The position calls for strong technical judgment, laboratory proficiency, and clear communication of complex findings to technical and non-technical audiences. The engineer collaborates with design, manufacturing, quality, reliability, and supplier teams to recommend corrective actions and verify their effectiveness.

Requirements

• Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related technical discipline and at least six years of relevant experience; or a graduate degree and at least four years of relevant experience; or, in lieu of a degree, at least ten years of relevant experience.

Nice To Haves

• Experience analyzing analog, digital, mixed-signal, RF, power, or discrete semiconductor components.
• Hands-on experience investigating failures in semiconductor devices, integrated circuits, or microelectronic packages.
• Demonstrated proficiency in electrical testing and physical failure analysis, including optical microscopy, X-ray inspection, cross-sectioning, SEM, photoemission microscopy, decapsulation, and delayering.
• Working knowledge of semiconductor device operation, fabrication processes, packaging technologies, and common failure mechanisms.
• Experience integrating results from multiple analytical techniques to develop evidence-based root cause conclusions.
• Demonstrated ability to write technical reports and communicate investigation results to technical and non-technical audiences.
• Ability to work independently and collaborate across multidisciplinary teams.
• Familiarity with advanced packaging, including flip-chip devices, ball grid arrays, stacked die, and multichip modules.
• Experience with complementary techniques such as energy-dispersive X-ray spectroscopy (EDS), scanning acoustic microscopy, or thermal imaging.
• Knowledge of physics-of-failure principles and methods for distinguishing component defects from assembly, application, or environmental causes.
• Experience supporting aerospace, defense, or other high-reliability electronics programs.
• Proficiency with data analysis and automation tools such as Python, MATLAB, or LabVIEW.
• Strong organizational skills and experience balancing multiple investigations with competing priorities.
• Active security clearance.

Responsibilities

• Lead microelectronic failure investigations from initial assessment and test planning through root cause determination, reporting, and corrective action verification.
• Develop analysis strategies based on device construction, failure symptoms, operating history, and available evidence, sequencing techniques to preserve critical information.
• Use optical microscopy and X-ray inspection to evaluate component condition, package integrity, internal structures, and potential assembly defects.
• Perform electrical testing and characterization to reproduce reported failures, identify abnormal device behavior, and isolate suspect circuits or connections.
• Apply photoemission microscopy and liquid crystal hotspot detection to isolate leakage-related phenomena on integrated circuits.
• Prepare samples through decapsulation, cross-sectioning, and controlled delayering to expose internal features while minimizing preparation-induced damage.
• Use SEM to characterize defects in semiconductor devices, metallization, bond wires, interfaces, and package interconnects.
• Correlate electrical measurements, imaging results, physical observations, and manufacturing or field history to distinguish failure symptoms from underlying causes.
• Evaluate potential mechanisms including electrical overstress, electrostatic discharge, corrosion, contamination, delamination, metallization damage, and interconnect fatigue.
• Collaborate with engineering, manufacturing, quality, reliability, and suppliers to translate investigation findings into practical design, material, or process improvements.
• Assess follow-up test results and analysis data to determine whether corrective actions address the identified failure mechanism.
• Prepare technical reports documenting methods, supporting evidence, conclusions, limitations, and recommended next steps.
• Present detailed findings to technical teams and provide concise, accessible summaries for program leadership, customers, and non-technical stakeholders.
• Manage concurrent investigations, communicate priorities and progress, and escalate technical risks or resource constraints.
• Develop and improve laboratory procedures, sample preparation methods, and analysis workflows.
• Provide technical guidance and mentoring to engineers and laboratory personnel.
• Maintain traceable investigation records and follow applicable laboratory safety, chemical handling, ESD control, and equipment procedures.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior