Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Applied Materials • Seongnam-si,

16d • Onsite

About The Position

The Senior Member of Technical Staff (Advanced Packaging Pathfinding) is a senior individual-contributor role responsible for driving pathfinding and early-stage technology development for N+2 and beyond advanced packaging architectures. The role focuses on disruptive innovation, technical problem-solving, and concept-to-feasibility execution to shape future integration solutions and create new value. It operates at the intersection of technology innovation, customer roadmaps, and ecosystem collaboration, translating emerging concepts into scalable capabilities aligned with Applied Materials’ long-term strategy.

The position drives long-range exploration in advanced packaging, including interconnect scaling, materials, and integration architectures. It leads hands-on development and feasibility studies for concepts such as D2W, RDL, CoWoS, TSV, and heterogeneous integration, and develops integration approaches such as mixed interconnect architectures, advanced bumping strategies, and next-generation substrates. The role owns technical modules or integration challenges, designs and executes experiments, simulations, and test vehicles, and develops scaling frameworks and design–process co-optimization strategies. It turns concepts into technical deliverables such as models, prototypes, and demonstration vehicles, and communicates findings to inform technology roadmaps and downstream development.

The role engages internal and external stakeholders to translate customer requirements and system trends—including AI, HPC, memory integration, and chiplets—into technical problems and solutions. It collaborates with materials suppliers, equipment teams, OSATs, foundries, and research partners on development and validation. It contributes data-driven technical recommendations to early-stage governance, influences cross-functional priorities, communicates technical narratives to executives, and mentors junior engineers. Travel is required 20% of the time. The work location is Science Park II, moving to Tampines in December 2026.

Requirements

• 10–15+ years of experience in semiconductor technology, with strong exposure to advanced packaging, process integration, or related domains.
• Demonstrated experience in technology development, pathfinding, or exploratory R&D.
• Strong understanding of advanced packaging technologies, including RDL, TSV, CoWoS, and hybrid bonding.
• Ability to solve complex technical problems and translate concepts into experimental validation.
• Strong communication skills to articulate technical insights and business relevance.

Nice To Haves

• Advanced degree (MS/PhD) in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related field.
• Experience in heterogeneous integration, chiplet architectures, or next-generation interconnect technologies.
• Track record of innovation, such as patents, publications, or first-of-a-kind solutions.
• Familiarity with design–process co-optimization and system-level trade-offs.

Responsibilities

• Drive long-range pathfinding exploration in advanced packaging for N+2 and beyond, identifying inflection points in interconnect scaling, materials, and integration architectures.
• Lead hands-on development and feasibility studies for advanced packaging concepts, including D2W, RDL, CoWoS, TSV, and heterogeneous integration schemes.
• Develop and validate new integration approaches, such as mixed interconnect architectures, advanced bumping strategies, and next-generation substrates.
• Perform technical analysis and trade-off assessments to guide design, process integration, and technology selection.
• Contribute technical insights and benchmarking to make/buy/partner evaluations.
• Own technical modules or integration challenges within pathfinding programs and drive concept-to-demonstration execution.
• Design and execute experiments, simulations, and test vehicles to validate ideas and reduce technical risk.
• Develop scaling frameworks and design–process co-optimization strategies for future performance, cost, and reliability requirements.
• Translate concepts into technical deliverables, including models, prototypes, and demonstration vehicles.
• Document and communicate findings to influence technology roadmaps and downstream development programs.
• Engage internal and external stakeholders to translate customer requirements and system trends into actionable technical problems.
• Identify technical challenges and gaps in current packaging approaches and propose solutions.
• Contribute to value proposition development by linking innovation to performance, cost, and scalability benefits.
• Collaborate with materials suppliers, equipment teams, OSATs, foundries, and research partners to co-develop and validate technologies.
• Support joint development efforts and early-stage collaborations, contributing technical expertise and insights.
• Leverage ecosystem capabilities to accelerate learning and reduce risk for new concepts.
• Provide data-driven technical recommendations to early-stage governance and decision frameworks.
• Influence cross-functional process, product, and integration teams on technology direction and development priorities.
• Develop executive-ready technical narratives that explain innovation value, risks, and trade-offs.
• Mentor junior engineers and contribute to technical depth and an innovation culture within the team.

Benefits

• Supportive work culture that encourages learning, development, and career growth.
• Employee health and wellbeing programs and support for personal and professional growth.
• Relocation eligibility.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: No Education Listed