Senior Mechanical Engineer, Manufacturing

Positron Corporation
•$185,000 - $250,000

About The Position

As a Senior Mechanical Engineer at Positron AI, you will own the mechanical, thermal-mechanical, and enclosure design of AI inference platforms, from carrier-board mechanical integration and chassis design through rack-level packaging of Asimov-based systems. You will ensure that the structural, thermal, and manufacturability characteristics of high-power hardware meet the demands of high-density HPC and data center environments. You will serve as the primary mechanical interface to contract manufacturers and custom-part fabricators, driving designs from concept through volume production with external partners. The role encompasses mechanical design and analysis, thermal and structural engineering, supplier and manufacturer engagement, design-for-manufacturing and assembly, fixture and packaging development, validation, and program governance. Specific responsibilities and impact expectations will be tailored to the experience and seniority of the successful candidate; Positron AI is open to hiring at a more senior level. The base salary range is $185,000–$250,000, excluding equity and other elements of total compensation. Positron AI also offers comprehensive benefits and describes its work environment as flexible and supportive, with room for technical growth and innovation.

Requirements

  • BS or MS in Mechanical Engineering.
  • At least 7 years designing electromechanical and enclosure hardware for high-performance electronic systems, spanning the NPI lifecycle from concept through volume production.
  • Expertise in 3D CAD, such as SolidWorks and/or Creo.
  • Experience with detailed drawings, GD&T, and tolerance stack-up analysis.
  • Experience with structural and thermal simulation, such as SolidWorks Simulation/Flow or Ansys.
  • Experience with rack-mount or high-density electronic packaging.
  • Direct experience selecting, qualifying, and managing custom-part suppliers and contract manufacturers, including global partners, through EVT/DVT/pilot phases.
  • Demonstrated track record applying DFM/DFA and FMEA to drive cost, quality, and manufacturability in high-volume or high-complexity production environments.
  • Ability to write clear mechanical specifications and communicate trade-offs across electrical, thermal, ASIC, firmware, and operations teams.

Nice To Haves

  • Mechanical and thermal design background in AI/ML accelerators, servers, or other high-power data center hardware.
  • Experience correlating CFD and thermal-mechanical simulations with real-world air- or liquid-cooled performance, including heatsinks, cold plates, and manifolds.
  • Experience with EMC/EMI shielding, environmental qualification (shock, vibration, thermal), and packaging/transit testing; familiarity with FCC/CE and RoHS/REACH.
  • Certifications such as Certified SolidWorks Professional, Ansys, DFMA, or ISTA packaging qualification.
  • Relevant patents.
  • Business or finance acumen, such as an MBA, connecting design decisions to cost and profitability.

Responsibilities

  • Own mechanical design of enclosures, chassis, and carrier-board mechanical integration for rack-mount 1U/2U inference systems, including spatial studies, conceptual and detailed design, solid models, drawings, BOMs, and tolerance stack-up analysis.
  • Lead thermal-mechanical and structural design and simulation for high-TDP ASIC platforms, including heatsinks, cold plates, retention hardware, airflow, and shock/vibration; partner with electrical and thermal teams to meet air- and liquid-cooled performance targets.
  • Act as the primary mechanical lead and company representative for contract manufacturers, ODMs, and custom-part fabricators through EVT, DVT, pilot, and production ramp.
  • Lead DFM/DFA reviews covering tolerances, assembly sequence, poka-yoke, part reduction and standardization, and DFMEA to reduce unit cost and improve design robustness.
  • Develop and qualify custom electromechanical fixtures for assembly and test.
  • Own product packaging design, transit qualification, and implementation.
  • Create mechanical test plans for structural, thermal, and environmental testing; support EMC/EMI shielding and regulatory needs.
  • Manage the mechanical risk register, ECOs, and technical escalations to keep programs on schedule for pilot and manufacturing ramps.
  • Write clear mechanical specifications and communicate design trade-offs across electrical, thermal, ASIC, firmware, and operations teams.

Benefits

  • Competitive compensation including salary and equity.
  • Comprehensive benefits.
  • Flexible, supportive environment with room for technical growth and innovation.
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