Senior Manager, Semi Packaging Engineering

Analog Devices•Wilmington, MA

3d•Onsite

About The Position

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible™. We are seeking a Senior Manager of Semiconductor Packaging to lead ADI’s packaging strategy, technology roadmap, and execution for MEMS modules and RF modules. This role is accountable for building and leading a high-performing team of individual contributors, driving cross-functional alignment, and delivering reliable, scalable, and cost-effective module packaging solutions from concept through high-volume manufacturing.

Requirements

Master’s degree or PhD in Mechanical Engineering, Electrical Engineering, or Materials Science.
15+ years of experience in semiconductor packaging and assembly engineering.
3+ years of people leadership experience, including hiring, performance management, coaching, and developing technical talent.
Demonstrated track record leading cross-functional programs from concept to production, managing multiple priorities, and delivering results against schedule, cost, and quality objectives.
Strong technical breadth across module packaging architectures, materials, assembly processes, reliability/qualification, and failure analysis; familiarity with MEMS and/or RF module integration requirements is a plus.
Experience working with OSATs and external suppliers, including capability assessments, yield/quality improvement, and supplier governance.
Working knowledge of structured problem-solving and quality tools (e.g., FMEA, DOE, SPC, 8D) and change management processes (e.g., PCN/ECN).
Excellent communication skills with the ability to influence stakeholders at all levels and translate technical trade-offs into business decisions.

Nice To Haves

Familiarity with MEMS and/or RF module integration requirements is a plus.

Responsibilities

Drive ADI’s MEMS and RF module packaging technology roadmap aligned to product and business roadmaps.
Lead, coach, and develop a team of packaging and module integration engineers; set goals, establish operating mechanisms, and build technical depth, best practices, and a strong talent pipeline.
Provide technical and program leadership for module package architecture and integration from concept and package selection through design, process development, qualification, and release-to-manufacturing.
Partner with cross-functional stakeholders to define requirements, trade-offs, and decisions for performance, cost, schedule, and risk.
Establish and govern OSAT/vendor engagement models for NPI and high-volume manufacturing, including capability assessments, process readiness, yield/quality improvement, and change control.
Drive module packaging reliability strategy and qualification standards for MEMS and RF products; oversee failure analysis, corrective actions, and continuous improvement to meet performance and reliability requirements.
Lead cost, quality, and cycle-time improvements through design-to-cost, material/process optimization, and supplier negotiations in partnership with procurement and operations.
Represent packaging at technical and business reviews, influence executive stakeholders, and communicate status, risks, and mitigation plans with clarity and data.