Senior IC Packaging Engineer

Microsoft•Redmond, WA

1d•$119,800 - $261,000

About The Position

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission. The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt. Our solutions provide sustainable strategic advantage to Microsoft and enable our customers to achieve more. As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Silicon Manufacturing & Package Engineering (SMPE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for seasoned engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure. We are looking for a Senior IC Packaging Engineer to join the team.

Requirements

Doctorate in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 1+ year(s) technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 4+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related field AND 5+ years technical engineering experience OR equivalent experience.
Ability to meet Microsoft, customer and/or government security screening requirements.
Must pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
Must provide proof of country of citizenship or US residency or other protected status for assessment of eligibility to access export-controlled information.
Must provide valid passport for citizenship verification or other documents for lawful permanent residents, refugees, and asylees.

Nice To Haves

Doctorate in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 3+ years technical engineering experience OR Master's Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 8+ years technical engineering experience OR equivalent experience.
Master’s Degree with 10 years experience in semiconductor package product development
5+ years hands-on experience in Semiconductor Package development, manufacturing, supplier management or quality management
Specific experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3D)
Foundation in advanced packaging technologies, manufacturing and supplier management
Proficient in IC package or PCB board layout CAD tools Cadence Allegro
Working knowledge in high-speed signaling, layout, electrical, mechanical and thermal co-designs.
Working knowledge in 2D and 3D simulation tools for full package layout extractions for power and signals analysis
Experience with OSAT, Supplier & Foundry technologies.
Experience in physical failure analysis
Experience in subcontract supplier management.
Strong verbal and written communication.
Record of success in cross-functional team environment

Responsibilities

Providing expertise, insight, and support to the Silicon device development team through the entire life cycle of the product.
Supporting the design and implementation of new custom Silicon devices, evaluation and recommendation of new packaging technology, Substrate design support, device/package qualification, supplier assessment, manufacturing bring up, and driving quality/reliability in development and production.
Drive optimal silicon packaging solution supporting Azure datacenter product roadmap.
Drive package technology for chiplet architecture with advanced 2.5D/3D packaging.
Drive 2.5D/3D packaging product designs (bridge/interposer/substrate) from definition, development to tapeout
Define, design and develop test vehicles to validate Silicon, Package, System performance.
Drive supplier assessments and manage suppliers through definition, development, qualification and production.
Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options.
Define EDA tools requirements for advanced 3DIC packaging designs
Design and develop package and assembly drawings to support the manufacturing.
Lead supplier assessments and manage suppliers through definition, development, qualification and production.
Assess and characterize the reliability of Integrated Circuits (IC) packages.
Design and develop package and assembly drawings to support the manufacturing.
Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
Drive execution of architecture solutions across product lines or multiple product groups and across teams that account for design trends and future concepts by leveraging cross-functional expertise, industry best practices, and lessons learned from teams working across multiple product lines.
Drive engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.