Senior Engineer, Semi Packaging Engineering
About The Position
Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. We seek a highly motivated Senior Packaging Engineer to drive package development and deployment within our New Product Introduction (NPI) pipeline. This role will work closely with Business Units, global operations, and external partners to deliver robust, scalable NPI packaging solutions while enabling supply chain resilience and continuous improvement in our development systems.
Requirements
- Master’s degree in Mechanical Engineering, Materials Science, Chemical Engineering, Applied Physics or related field
- 3-4 years of experience in a fast-paced microelectronics or semiconductor packaging environment
- Strong understanding of semiconductor assembly processes and package qualification methodologies
- Experience working in fast paced cross-functional, global development environments
- Demonstrated ability to drive projects from concept through production
- Experience in use of 2D AutoCAD.
Nice To Haves
- 3D CAD tools a plus.
- Experience in systems integration and/or NPI systems development
- Familiarity with assembly master data structures and change management processes
- Familiarity with data analytics tools such as KNIME or RDBMS systems.
- Experience working with OSATs / subcontractor ecosystems, particularly in Asia
- Experience with simulation tools like Flotherm and ANSYS, and MS Office tools
- Strong problem-solving and analytical skills
- Self-starter, ability to operate effectively in a fast-paced environment
- Excellent communication and stakeholder management skills
- Results-oriented with a focus on execution, impact and continuous improvement
Responsibilities
- Partner with Business Units to define, develop, and release semiconductor packaging solutions as part of the NPI pipeline
- Drive package design, qualification, and production readiness to meet performance, cost, and schedule requirements
- Work closely with design, reliability, QA, and operations teams to ensure seamless product introduction
- Interface with global subcontractor partners, particularly in Asia, to execute development and production plans
- Support and lead operations-initiated projects focused on supply chain resiliency, cost optimization, and dual-sourcing strategies
- Identify and mitigate packaging-related risks across the supply base
- Contribute to the architecture and continuous improvement of NPI systems and workflows
- Help define best practices for package release, change management, and data integrity
- Utilize data-driven approaches to improve development cycle time and decision-making
- Work with assembly master data and leverage insights using data analytics platforms such as KNIME
Benefits
- medical, vision and dental coverage
- 401k
- paid vacation
- holidays
- sick time
- discretionary performance-based bonus
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What This Job Offers
Job Type
Full-time
Career Level
Senior
