Staff Engineer, Semi Packaging Engineering

Analog Devices•Wilmington, MA

4d•$113,190 - $163,905•Onsite

About The Position

This role will be responsible for the development of advanced packaging solutions for semiconductor devices across various market segments. The packaging solutions must meet demanding product requirements while balancing reliability, manufacturability, and cost. Candidates will be expected to: Lead the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products. Provide technical leadership in package mechanical and thermal analysis to support package architecture selection, design optimization, and reliability risk assessment. Perform mechanical simulations of IC packages and systems using FEM tools to evaluate chip-package interaction, package-board interaction, warpage, stress, and reliability risks. Perform component- and system-level thermal simulations for semiconductor packages using commercial simulation tools. Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues. Collaborate with OSAT partners, substrate suppliers, and material vendors to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield. Work with quality and reliability teams to establish reliability criteria and qualification plans for semiconductor products across various market applications. Develop and maintain package design guidelines, process specifications, simulation methodologies, and technical documentation.

Requirements

PhD or Master’s degree in Mechanical Engineering or Electrical Engineering.
5+ years of hands-on experience in semiconductor packaging development, package simulation, or packaging manufacturing.
Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
Hands-on experience with major FEM tools; ANSYS experience is preferred.
Strong analytical, problem-solving, communication, and collaboration skills.
Ability to work effectively in cross-functional teams and influence technical decisions across organizations.

Nice To Haves

Experience with FloTHERM, Sigrity, or Icepak is a plus.
Experience with Cadence Allegro is a plus.

Responsibilities

Lead the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
Provide technical leadership in package mechanical and thermal analysis to support package architecture selection, design optimization, and reliability risk assessment.
Perform mechanical simulations of IC packages and systems using FEM tools to evaluate chip-package interaction, package-board interaction, warpage, stress, and reliability risks.
Perform component- and system-level thermal simulations for semiconductor packages using commercial simulation tools.
Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.
Collaborate with OSAT partners, substrate suppliers, and material vendors to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
Work with quality and reliability teams to establish reliability criteria and qualification plans for semiconductor products across various market applications.
Develop and maintain package design guidelines, process specifications, simulation methodologies, and technical documentation.