Staff Semi Packaging Engineer

Analog Devices•San Jose, CA

3d•Onsite

About The Position

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. We are looking for a highly motivated Packaging Engineer who will drive IC package and power module development activities for ADI’s new and existing products. This position will be based in San Jose, CA. Late afternoon/early evening conference calls are expected. Work closely with internal reliability team, business units, and supply chain management team to provide package engineering support. Plan and drive for on time delivery of package development projects.

Requirements

Master’s degree in Materials Science and Engineering, Applied Physics, Electrical Engineering, or Mechanical Engineering is required with at least 3 years of industrial working experience in related fields.
In-depth knowledge and experience in analog IC package and module design, optimization, and manufacturing.
Knowledge in IC package reliability requirements, failure analysis techniques, assembly process issues, etc.
Knowledge and experience in selecting IC package bill of material (BOM): solid understanding of mechanical, thermal, and electrical properties of materials, including semiconductors, metals, ceramics, and polymer composites.
Solid skills/experience in CAD tools are desired to create package design models and drawings for package development, simulation, and documentation.
Experienced in manufacturing control plan, process failure mode and effects analysis (FMEA), process change notification (PCN), statistical process control (SPC), and design of experiment (DOE).

Nice To Haves

PhD. degree is preferred.
Package-level and system-level thermal/mechanical/electrical/magnetic simulation skill is a plus.

Responsibilities

Drive the development and adoption of advanced IC package platforms and processes, such as embedded package and fan-out wafer-level package.
Design and optimize IC packages for a wide range of ADI products, using common and advanced analog IC package platforms and assembly/bumping processes.
Design and optimize power modules for performance, manufacturing, and reliability.
Define, maintain, and advance package design rules for emerging package platforms and power modules.
Work closely with ADI’s oversea assembly subcontractor/OSATs for new package development and other package-related engineering activities.
Work closely with internal reliability team, business units, and supply chain management team to provide package engineering support.
Plan and drive for on time delivery of package development projects.