Analog Devices (ADI) is seeking a highly motivated Packaging Engineer to develop and manage Wafer Level Packaging (WLP) technologies on several platforms. This role involves supporting ADI’s Worldwide Business Units and Customers, and engaging with subcontractors/OSATs in South East Asia. The engineer will be responsible for developing and qualifying competitive WLP solutions, defining new product requirements in collaboration with Business Units, Designers, and Marketing, and managing product-package development at subcontractors. A key aspect of the role includes working closely with Quality/Reliability groups to ensure package qualification, design-for-manufacturability, and design-for-reliability. The engineer will also review production metrics, monitor process capability data (Cpk) at subcontractors, and manage process changes that impact product performance while driving cost-competitive solutions.
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Job Type
Full-time
Career Level
Senior
Education Level
Ph.D. or professional degree