Senior Engineer, Semi Packaging Engineering

Analog Devices•Wilmington, MA

3d•Onsite

About The Position

Analog Devices (ADI) is seeking a highly motivated Packaging Engineer to develop and manage Wafer Level Packaging (WLP) technologies on several platforms. As a WLP engineer, you will support ADI’s Worldwide Business Units and Customers and engage with subcontractors/OSATs in South East Asia. ADI is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. With revenue of more than $11 billion in FY25, ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers.

Requirements

Ph.D or Master’s degree in Mechanical or Material, or Electrical engineering required.
Relevant experience in wafer-level package development, process, equipment, qualification and manufacturing implementation.
Knowledge of package reliability requirements, failure analysis techniques, assembly process issues, etc.

Nice To Haves

Knowledge on Ansys or Flotherm a plus.

Responsibilities

Develop/Qualify competitive Wafer-Level Packaging solutions to support new product integration.
Partner with Business Units, Designers, and Marketing to define requirements of new products; Maintain clear understanding of product requirements and manage product-package development at subcontractors/OSATs.
Work closely with Quality/Reliability groups to qualify packages and ensure design-for-manufacturability and design-for-reliability.
Review & Manage process changes at subcons that impact product performance and drive cost competitive solutions.
Review of production metrics and monitor process capability data (Cpk) at subcons.