Engineer, Semi Packaging Engineering

Analog Devices•Wilmington, MA

9h•Onsite

About The Position

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. We are seeking a highly motivated Systems Semiconductor Packaging Engineer to join a multidisciplinary team developing advanced semiconductor modules and systems level solutions for Healthcare, Industrial, New Energy, Robotics and Physical AI applications. This role will drive product realization from concept through manufacturing by working closely with cross-functional design teams, OSAT, ODM and EMS partners, material suppliers and global manufacturing vendors across multiple time zones. The ideal candidate should have 2 - 5 years of experience in semiconductor packaging, system integration, manufacturing process development and reliability engineering.

Requirements

Master’s degree in engineering (mechanical/ material science/semiconductor engineering/ applied physics or equivalent)
Must have 2 to 5 years of industrial working experience in advanced semiconductor packaging; electronics assembly or systems integration engineering and test.
Experience working with OSATs, substrates, EMS partners and semiconductor manufacturing ecosystems.
Strong understanding of advanced semiconductor packages, modules, systems, heterogeneous integration and materials including substrates, adhesives, underfills, mold compounds, TIMs and Interconnect materials.
Familiarity with design controls, thermo-mechanical simulation tools, process development tools and methodologies including DOE, PFMEA, SPC, 8D, RCA and statistical data analysis.
Required to have educational background in fundamentals of materials and their mechanical behavior.
Ability to apply them in mechanical design.
Experience with 3D CAD tools (SolidWorks or equivalent) for design reviews and design modifications
Demonstrate engineering aptitude with learning mindset, excellent analytical, and problem-solving skills.
Must be able to demonstrate exceptional communication skills during interview process.

Nice To Haves

Exposure to working in regulated manufacturing environment for Medical / Industrial/ Robotics devices will be a distinct advantage.

Responsibilities

Work closely with cross-functional teams to design and develop advanced systems level packaging solutions including heterogeneous packaging solutions, multi-chip modules, sensor packages and high-density interconnect assemblies.
Lead assembly process developments to support Digital Health Care, Medical Devices, Industrial, Robotics and Physical AI applications.
Adheres to strict documentation practices in a regulated environment and owns design control processes.
Engineer new materials, processes and assembly capabilities to suit to end applications.
Own manufacturing engineering activities including process characterization, collaborate with QA and Reliability teams to drive root cause analysis, yield improvements and Corrective/ preventive actions (CAPA) to meet manufacturability, scalability, and cost optimizations.
Drive PFMEA, DOE, SPC, GR&R and statical analysis activities to improve process capability, assembly robustness and long-term reliability.
Work closely with OSATs, substrates vendors, PCB suppliers and assembly partners to define package architecture, DFM/DFX requirements and qualification strategies.
Takes accountability in design and process development for high volume production.
Benchmark industry best practices and evaluate emerging technologies for design and process innovation.
Ability to collate information with appropriate supporting data and present into a coherent report for communication and distribution.
Communicate complex technical concepts effectively to global engineering, operations, suppliers and executive teams.