Senior Electrical Engineer – TeraWave High-Speed Digital & Networking Payload Hardware

BLUE ORIGIN•Seattle, WA

25d•$156,802 - $219,522

About The Position

At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight! Blue Origin is pioneering the future of space-based communications with TeraWave, a revolutionary satellite communications network designed to deliver symmetrical data speeds of up to 6 Tbps anywhere on Earth. This multi-orbit constellation will consist of optically interconnected satellites in low Earth orbit (LEO) and medium Earth orbit (MEO), providing enterprise-grade connectivity for critical operations worldwide. About the Role You will design, analyze, and validate complex circuit card assemblies for high-speed digital and networking payload systems operating in demanding environments. You will own hardware from concept through production, working across a cross-functional team that includes FPGA, software, test, and manufacturing engineers.

Requirements

Bachelor's degree in Electrical Engineering or related field
7+ years of experience in hardware design for aerospace, defense, or other high-reliability applications
Demonstrated experience with high-speed digital circuit design and analysis
Strong problem-solving skills with the ability to work independently and drive issues to closure
Effective communication skills for cross-functional collaboration across engineering disciplines
Hands-on experience with circuit-level analysis to validate design margin and requirements compliance

Nice To Haves

Experience with high-speed serial and parallel interface standards including SerDes, Ethernet (1G/10G/25G/100G), UART, SPI, I3C, MDIO, and IEEE 1588 Precision Time Protocol (PTP)
Familiarity with network switching architectures and IP-layer networking concepts in embedded hardware contexts
Experience with circuit simulation tools (e.g., SPICE, HyperLynx, HFSS) and formal design verification methods
Knowledge of EMI/EMC design principles and system-level integration considerations
Experience with PCB layout — particularly techniques to improve signal integrity, power integrity, and thermal performance in high-density, high-speed designs
Experience designing for reliability in radiation-tolerant or space-heritage environments (e.g., part selection, derating, latch-up mitigation)
Experience with environmental qualification testing including vibration, thermal cycling, and shock testing

Responsibilities

Collaborate with systems and subsystem stakeholders to translate program requirements into hardware designs that meet performance, reliability, and SWaP-C (Size, Weight, Power, and Cost) constraints
Perform rigorous circuit-level analysis including Worst Case Analysis (WCA), Component Derating Analysis, Design Failure Modes and Effects Analysis (DFMEA), and Signal and Power Integrity (SI/PI) analysis
Represent hardware across the full development lifecycle — interfacing with procurement, software, FPGA, harness, test, and manufacturing teams
Apply Design for Manufacturing (DFM) and Design for Test (DFT) best practices to support high-volume production; perform Process Failure Modes and Effects Analysis (PFMEA)
Lead and support bring-up, debug, and functional verification of complex circuit card assemblies
Operate independently, managing priorities, risks, and opportunities in a fast-paced development environment
Contribute to an agile program management cadence through sprint-based planning and execution