High-Speed Digital Design Engineer

viaPhoton • Naperville, IL

6h • $80,000 - $150,000 • Onsite

About The Position

This role involves advancing the development of 200G+ systems and interfaces for next-generation Co-Packaged Optics (CPO) products. The engineer will own the high-speed electrical data path from concept to production, focusing on deep, hands-on signal and power integrity work at the cutting edge of AI data center connectivity. The position also includes guiding and mentoring junior engineers.

Requirements

• BS in Electrical Engineering
• 3+ years of hands-on high-speed design experience
• Background in high-speed transceiver or transponder development, ideally for 200G/PAM4+ interconnect
• Experience designing and applying 224G/448G PAM4 or PAM6 interconnect and related OIF-CEI or IEEE standards
• Well-versed in high-speed signaling fundamentals, channel behavior, PCB technologies, and RF design techniques
• Comfortable with SI simulation tools such as ADS or HFSS, and with EMI/EMC evaluation and mitigation

Responsibilities

• Advance the development of 200G+ systems and interfaces for NPO and CPO products, including 224G/448G PAM4 signal and power integrity (SIPI).
• Own technology selection, architecture, development, integration, and productization of cutting-edge CPO solutions.
• Define PCB material selection and stack-ups, and evaluate S-parameters, eye diagrams, crosstalk, jitter, and COM performance.
• Assess host (switch fabric and xPU) and optical technologies, including compute fabrics and scale-up/scale-out topologies.
• Guide the electrical data path from concept to production.
• Mentor junior design team members.

Benefits

• Robust health, dental, and vision coverage that starts on day 1
• 401(k) with match, vests immediately after a 90-day waiting period
• Flexible PTO that grows over time
• 10 paid holidays, including 2 floating holidays
• Monthly team events

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level