Applications Engineer – Semiconductor 3D X-ray Solutions

Applied Materials•Benicia, CA

68d•$108,000 - $148,500•Onsite

About The Position

Applied Materials is seeking a Senior Applications Engineer to join a growing team advancing 3D X-ray solutions for semiconductor applications. The role collaborates with customers and internal teams to enable inspection, metrology, and failure-analysis workflows, and serves as a technical interface between engineering, sales, marketing, and semiconductor customers. The position focuses on establishing workflows for semiconductor inspection and analysis, identifying new applications of 3D X-ray technology across front-end and back-end processes, and addressing problems related to yield, reliability, process development, and advanced packaging. The engineer leads system demonstrations, develops semiconductor-specific applications and methodologies, provides input to product specifications, trains customers, optimizes workflows, and conducts tool characterization and benchmarking. The role also supports technical presentations, conferences, trade shows, and technical publications. The position is based in Benicia, California, with travel required.

Requirements

Bachelor’s or master’s degree in a relevant technical field, such as Materials Science, Physics, Electrical Engineering, or a related discipline.
3–5 years of experience in a semiconductor-related field, such as fabs, failure analysis, metrology, or process development.
Hands-on experience designing experiments, analyzing data, and delivering results in a commercial or customer-facing environment.
Ability and willingness to travel domestically and internationally; the role listing states travel of up to 30% and also lists 25%.

Nice To Haves

Background in microscopy or advanced imaging techniques, such as X-ray CT, SEM, or FIB.
Working knowledge of X-ray absorption principles and imaging or optical fundamentals.
Experience with semiconductor capital equipment, particularly inspection, metrology, or failure-analysis workflows.
Familiarity with advanced semiconductor technologies, such as 3D IC, heterogeneous integration, and advanced packaging.

Responsibilities

Lead system demonstrations for semiconductor customers, including fabs, failure-analysis laboratories, and R&D centers.
Develop applications and methodologies tailored to semiconductor devices, processes, and packaging technologies.
Provide input to product development and system specifications based on customer needs and application gaps.
Deliver advanced customer training on system operation, data acquisition, and analysis workflows.
Design, develop, and optimize workflows for semiconductor inspection and analysis.
Perform tool characterization, benchmarking, and baseline performance studies for semiconductor use cases.
Provide technical leadership in customer-facing support activities, presentations, demonstrations, conferences, trade shows, and technical papers.
Work with customers to understand technologies and critical gaps, and support solutions through implementation.
Lead complex application activities and execution teams for customer-site evaluations and demonstrations.
Interface with customers regarding technical requirements and schedules.
Define or approve product application support plans for installation.
Develop methodologies to optimize system performance for specific applications.
Analyze, develop, and transfer new application capabilities from the product division to customer application support teams.
Lead customer technical review meetings.
Establish workflows for routine semiconductor inspection and analysis, identify new uses for 3D X-ray technology, and address high-value problems related to yield, reliability, process development, and advanced packaging.