Semiconductor Research Engineer

Intel•Chandler, AZ

1d•$141,910 - $200,340•Onsite

About The Position

As a Semiconductor Research Engineer, you will advance Intel’s assembly and packaging technologies by designing, developing, and testing devices, interconnects, and packaging solutions. The work applies device physics, electromagnetics, and materials science, and includes hands-on prototyping and research to optimize performance, reliability, and cost. The role is part of Intel Corporation’s Assembly Materials Characterization Lab within the Core Competency of Advanced Design and Customer Enabling. The group conducts research and development on next-generation metrology solutions for advanced packaging, supporting miniaturization, performance enhancements, and functionality. The position is based on-site in Phoenix, Arizona.

Requirements

Master’s degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field and 4+ years of experience, or a PhD and 2+ years of experience.
Research experience in optical test metrology, dimensional metrology, and packaging design methodologies.
Programming skills in Python or MATLAB for engineering applications.
Experience with experimental setups and data analysis techniques for lab testing.
Analytical and problem-solving abilities.
Excellent organizational and communication skills.

Nice To Haves

Experience with advanced Co-Packaged Optics (CPO).
Experience with advanced packaging technologies such as EMIB and Foveros architectures.
Expertise in Design of Experiments (DOE), statistical analysis methods, and model-based problem-solving techniques.
Familiarity with materials characterization techniques and cross-disciplinary collaboration.

Responsibilities

Conduct research using device physics, optics, electromagnetics, and thermomechanical analysis to enable novel devices and packaging technologies.
Design and fabricate metrology prototypes to validate concepts for semiconductor assembly and interconnect solutions.
Develop testing methodologies for component and device characterization, including dimension, optical signal loss, and stressing.
Plan and execute experiments with cross-functional teams and benchmark results against industry standards.
Model and analyze trade-offs between design, performance, and reliability.
Collaborate with external vendors and researchers to support Intel’s research pipeline.
Lead and influence technical teams to achieve milestones.
Present findings and mentor team members.