Semiconductor Power Component Architect

Bosch Group•Roseville, CA

1d•Onsite

About The Position

We are seeking a highly motivated power component architect (PCA) for our silicon carbide product release team in Roseville. As a PCA you will work on innovative product developments based on Silicon Carbide under tight timing with demanding customers for the automotive applications as part of a team of international experts. The PCA plays a central role in the release process of bare-die and discrete SiC products for use in automotive electronics of the future. Success in this role relies on intense collaborations with the team and all relevant stakeholders and a high degree of personal responsibility. This requires the ability to coordinate and communicate with the different project stakeholders about technical performance of our devices during the release process and beyond. Furthermore, the role requires affinity with documentation, formal procedures and adherence to good practices and methods. The work involves a significant amount of data analysis, which means that fundamental understanding of statistics is a prerequisite. Basic programming skills (e.g., Python, MATLAB) or a strong willingness to learn are highly valued. Finally, you will be responsible for product support on the development side after series release, identifying root causes of failures, and collaborating with cross-functional teams to drive continuous improvement in our processes. The ideal candidate will have a strong background in semiconductor physics and manufacturing, statistical data analysis, along with the ability to work structured and efficiently in a dynamic and fast-paced environment.

Requirements

Completed university studies (Master's) in (semiconductor device) physics, electrical engineering, or equivalent in education.
Experienced in statistical data analysis, applied statistics and Design of Experiments (DOE).
Programming skills for efficient data evaluation and analysis, e.g. Python or equivalent.
Sound knowledge of the physics of semiconductor devices and their characterization.
Analytical Mindset: Capability to break down highly complex, multi-domain problems into structured, logical, and actionable architectural approaches.
Risk & Trade-Off Analysis: Capable of analyzing technical trade-offs (e.g., performance vs. cost) and predicting architectural risks before they impact on our customers.
Excellent skills in technical procedure writing / documentation and verbal communication.
Communicative team player with the ability to coordinate teams and a high degree of willingness to work across departments in an international environment.

Nice To Haves

Knowledge of semiconductor manufacturing processes desirable.
Relevant experience in the development of power semiconductors is desirable.
Travel (including internationally) as needed.
Knowledge about (power) semiconductor manufacturing
Knowledge of German language (speaking, reading, writing) is a plus
Experience with electrical laboratory measurements and its challenges and limitations

Responsibilities

Managing the chip specifications of our silicon carbide power devices: Data analysis, product- and technology release processes and stakeholder management, incl. formal release aspects and documentation.
Sample planning and coordination of verification and validation testing during the engineering phase.
Definition of a series testing concept to safeguard device performance over lifetime during production.
Support in technical focus topics and setting-up as well as maintaining engineering methods and structures.
Product support on the development side after series release, identifying root causes of failures, and collaborating with cross-functional teams to drive continuous improvement in our processes.