PCS Sales Engineer, Israel

Corning•Moline, IL

6d•Onsite

About The Position

Corning is seeking a Sales Engineer to support strategic engagement with NVIDIA, with a primary focus on Co Packaged Optics (CPO) and advanced data center connectivity solutions. This role will partner closely with Corning’s PCS and Data Center Business Unit (DCBU) teams and work directly with NVIDIA engineering and architecture organizations to enable system level design, validation, and large scale deployment of optical connectivity solutions. Based in Israel, the Sales Engineer plays a highly customer facing role and is critical to accelerating design wins, supporting complex CPO programs, and shaping next generation PCS and data center interconnect solutions.

Requirements

Direct experience supporting customer facing technical roles within data center, networking, optical, or semiconductor environments.
Familiarity with PCS and data center connectivity product portfolios, including optical assemblies, shuffle solutions, and high density cabling architectures.
Experience supporting fast paced development cycles and large scale ramp or deployment programs.
Background working with hyperscale data center customers, networking OEMs, or semiconductor companies.
Strong system level thinking with the ability to bridge component, interconnect, and platform considerations.
Proven ability to operate effectively in global, matrixed organizations and collaborate across regions and functions.
Excellent communication skills with the ability to influence, advise, and build trusted relationships with both customers and internal stakeholders.
Ease with frequent customer interactions at technical level, comprehend needs, convey value.
Work independently with little supervision.
Interface and communicate effectively with all levels of personnel, internal and external.
Bachelor’s Degree – Engineering, Physics, or Applied Science.
Minimum of 3 years’ experience in optical fibers and connectivity.
Familiarity and experience with multi-layer physical layer data center network topologies like spine and leaf.
Familiarity with Scale Out, Scale Up, and Scale Across AI network architectures.
Experience using a CRM, especially Salesforce.
Experience with Microsoft Word, Excel, PowerPoint, Outlook, OneDrive, and SharePoint.

Nice To Haves

Master’s desired.
PhD a plus.
Layer 2 Networking Certification a plus.
Semiconductor experience a plus.

Responsibilities

Serve as Corning’s primary field technical interface to NVIDIA engineering and architecture teams in Israel.
Lead and support system level architecture discussions spanning hardware platforms, CPO implementations, optical connectivity, shuffle boxes, and high density interconnect solutions.
Engage regularly with customer teams to understand technical requirements, constraints, deployment challenges, and future roadmap direction.
Support NVIDIA programs involving Co Packaged Optics, including connectivity considerations beyond the package and into the system and rack level.
Provide technical expertise and application guidance across PCS and data center optical connectivity solutions, including: Fiber Array Units (FAUs), Shuffle boxes, MMC / MTP based jumpers and optical assemblies, High density structured cabling solutions.
Contribute to reference architectures, cabling guides, and application documentation in close collaboration with PCS product management and engineering teams.
Lead technical evaluations, design in activities, and validation efforts from early development through production ramp.
Support demonstrations, prototyping iterations, troubleshooting, and corrective actions across development and deployment phases.
Translate NVIDIA technical feedback into clear, actionable inputs for Corning PCS/DC engineering, manufacturing, and product management teams.