RF Package Design Engineer, Senior Staff

Qualcomm•San Diego, CA

3d•$191,800 - $287,800

About The Position

This position is a senior leadership role responsible for leading RF Package Design, focusing on Electrical Characterization of RF Packages in collaboration with RF design leads. The role involves defining the packaging roadmap, projecting resource needs, and developing the company's technical capabilities in RF packaging for 6G Infrastructure and consumer devices. The candidate will work within a cross-functional team, interacting with RF-IC, PCB, RF-EM, System, and Process Technology Development teams. In addition to technical responsibilities, the role includes managing, training, hiring, and mentoring junior engineers, and working across multiple geographies.

Requirements

Master's degree in Science, Engineering, or related field
10+ years of RF Package/PCB design experience
Solid understanding and experience in Electromagnetics, Transmission line theory & Crosstalk
Proficiency in field solvers such as Ansys HFSS, Q3D and PSI
Proficiency in simulation tools such as ADS and Hspice
Good knowledge in design tool such as Cadence Allegro/APD/Sip or Mentor Xpedition
Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 5+ years of System/Package Design/Technology Engineering or related work experience.
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ year of System/Package Design/Technology Engineering or related work experience.

Nice To Haves

Ability to optimize RF design & analysis flow and being able to automate it
Thorough understanding of Packaging technologies and industry landscape in RF Packaging
Familiarity with Analog & RF-IC design
Proficiency in MatLab
Experience in programming language(c/c++) or scripting language (Perl/Python) is a plus
People Management experience is a plus
Ph.D. with 10+ years of experience or Master’s Degree with 15+ years of experiences

Responsibilities

Working with Package designer & various RF-IC block owners (Tx, Rx, LO, PLL, ADC/DAC, etc.) to discuss bump/ball assignments, perform early analysis and discuss trade-offs to optimize the design.
Establish BKM how to extract 3D parasitic models for various RF packages in ANSYS Electronic Desk Suite (HFSS/3D Layout/Q3D/SIWave).
Guide team how to troubleshoot various RF problems (DC convergence, leakage, and isolation) efficiently in testbench.
Further define methodologies for RF simulations for various Package type, frequency band and IP requirements.
Work with Advanced Technology team to develop more robust future RF PKG technology.
Update the design & analysis flow and automate the process.
Create technical documentation and presentations.
Recruit and lead team of engineers. Provide technical mentoring to junior team members.