This position is part of the National Institute of Standards and Technology (NIST) Professional Research Experience Program (PREP). The PREP program involves staff from a wide range of backgrounds conducting scientific research across various fields. Individuals in this position will perform technical work supporting the collaboration's scientific research. The candidate will join a multidisciplinary team of scientists working to advance nondestructive defect detection metrology for advanced semiconductor packaging by developing reference artifacts and benchmark datasets. The candidate will contribute to various aspects of the project, including, but not limited to, designing CAD models, running X-ray computed tomography (XCT) simulations, performing XCT reconstructions to generate datasets, preparing samples for FIB/SEM, and nanofabrication. The candidate will develop a Python script or package to automate these processes. Additionally, the candidate will use a team-developed generative modeling process to produce 3D models with seeded defects. The datasets will be used to evaluate defect detection and image segmentation algorithms, including those based on deep learning principles. The incumbent will analyze the resulting measurements, perform image processing, and extract meaningful information to support the research goals outlined in the experiment plan. They will organize the measured and analyzed datasets for publication, communicate with the team, and share the results at conferences and in publications.
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Career Level
Mid Level