Temporary Research Assistant – Chemical Mechanical Polishing

Clarkson University • Potsdam, NY

9d • Onsite

About The Position

Clarkson University seeks a Temporary Research Assistant to support an industry-sponsored research project in tungsten chemical mechanical polishing (CMP). The position will involve CMP experimentation, slurry formulation and evaluation, electrochemical characterization, surface metrology, defectivity analysis, quantitative data analysis, and technical reporting.

Requirements

• Ph.D. in Physics, Materials Science and Engineering, Chemical Engineering, or a closely related field.
• Research experience in chemical mechanical polishing, semiconductor materials processing, materials characterization, electrochemistry, surface science, or a related area.
• Experience with laboratory experimentation and quantitative data analysis.
• Strong scientific writing, data presentation, and communication skills.
• Ability to work independently and collaboratively in a research environment.

Nice To Haves

• Hands-on experience with chemical mechanical polishing (CMP).
• Experience with electrochemical methods and analysis.
• Experience with materials and surface characterization techniques.
• Experience with experimental design and quantitative analysis of research data.
• Record of peer-reviewed research publications.

Responsibilities

• Conduct laboratory experiments related to chemical mechanical polishing and surface processing.
• Prepare experimental formulations and samples.
• Perform electrochemical measurements and analysis.
• Conduct materials and surface characterization.
• Analyze and interpret experimental data.
• Maintain accurate laboratory records and document research results.
• Prepare scientific figures, technical reports, presentations, and research manuscripts.
• Assist with other research activities related to the sponsored project.

What This Job Offers

• Career Level: Executive
• Education Level: Ph.D. or professional degree