Clarkson University seeks a Temporary Research Assistant to support an industry-sponsored research project in tungsten chemical mechanical polishing (CMP). The position will involve CMP experimentation, slurry formulation and evaluation, electrochemical characterization, surface metrology, defectivity analysis, quantitative data analysis, and technical reporting. Candidates with research experience in CMP, electrochemical methods, semiconductor materials processing, surface and interface characterization, or surface metrology are strongly preferred. Experience correlating CMP process parameters with material removal, surface quality, and defectivity is particularly desirable.
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Career Level
Entry Level
Education Level
Ph.D. or professional degree