Reliability Engineer - Compound Semiconductor ICs

Keysight Technologies, Inc.•Santa Rosa, CA

2d•Onsite

About The Position

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~16,800 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers. Join a team at the forefront of semiconductor innovation, enabling the breakthrough technologies that differentiate Keysight's industry-leading design enablement solutions. As a Reliability Engineer, you will work hands-on with some of the world's most advanced compound semiconductor ICs and high-performance interconnect technologies that power next-generation RF, microwave, millimeter-wave, and high-speed digital products. In this role, you will play a critical part in ensuring that cutting-edge technologies meet the demanding performance, quality, and lifetime expectations of Keysight customers. You will collaborate closely with device engineers, process technologists, product designers, and manufacturing teams to evaluate, qualify, and continuously improve the technologies that form the foundation of Keysight's product leadership. If you are excited by advanced semiconductor technology, data-driven problem solving, and the challenge of ensuring reliability in products operating at the leading edge of performance, this role offers an opportunity to make a visible and lasting impact.

Requirements

B.S. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related technical field (or equivalent industry experience).
Proven experience in 1 or more of the following key areas:
Strong understanding of transistor and diode operation, including device characteristics, performance tradeoffs, and failure mechanisms.
Solid foundation in semiconductor device physics and the underlying principles governing device behavior and reliability.
Experience with advanced interposer, packaging, and interconnect technologies, including an understanding of the physical mechanisms that influence long-term reliability and performance.
Strong background in probability, statistics, and data analysis, with the ability to draw meaningful conclusions from complex datasets.
Excellent analytical and problem-solving skills, with a demonstrated ability to investigate challenging technical issues and develop data-driven solutions.
Effective communication and interpersonal skills, enabling productive collaboration across multidisciplinary engineering teams.
A high level of ownership, accountability, initiative, and self-motivation, with a proactive approach to tackling technical challenges and driving results.
Candidates must be a U.S. citizen or lawful permanent resident of the U.S., or protected individual, having authorization from the U.S. government for export-controlled items under 8 U.S.C. 1324b(a)(3).

Nice To Haves

Knowledge of III-V semiconductor technologies and the physics of high-performance compound semiconductor devices.
Experience with high-frequency device technologies, including device fabrication, process integration, characterization, or reliability evaluation.
Hands-on experience applying Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies in a research, development, or manufacturing environment.
Expertise in both semiconductor device reliability and advanced interconnect/package reliability.
A passion for understanding how advanced semiconductor technologies work—and why they fail.
The ability to connect device physics, reliability behavior, and statistical analysis to solve complex engineering problems.
Curiosity and enthusiasm for working on technologies operating at the forefront of RF, microwave, millimeter-wave, and heterogeneous integration performance.
A desire to influence the qualification and deployment of the technologies that directly enable Keysight's next generation of differentiated products.

Responsibilities

Design, develop, and execute reliability qualification strategies for advanced compound semiconductor ICs, interposer technologies, and next-generation packaging and interconnect solutions.
Evaluate emerging semiconductor and integration technologies, ensuring they meet the stringent reliability requirements of high-performance Test & Measurement applications.
Apply advanced statistical and data analysis techniques to identify reliability risks, understand failure mechanisms, and guide technology development decisions.
Build and expand reliability characterization infrastructure, enabling the rapid assessment of new technologies while supporting future growth in capability and test capacity.
Partner with technology development, product engineering, and manufacturing teams to translate reliability data into action that drives product success.
Communicate results to technical and business stakeholders, influencing technology roadmaps and qualification decisions.