R&D Hardware Engineer

Keysight Technologies, Inc.•Colorado Springs, CO

19h•Onsite

About The Position

Keysight is a technology innovation leader, providing breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. With approximately 15,000 employees, Keysight delivers world-class solutions across communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets to customers in over 100 countries. The company fosters an award-winning culture that embraces a bold vision for technology and a passion for solving challenging problems with industry-first solutions, believing that a sense of belonging fosters creativity, innovation, and career growth. A key success factor for Keysight is the development and deployment of breakthrough digital, analog, and mixed-signal Application Specific Integrated Circuits (ASICs), modules, and subsystems that enhance the performance, differentiation, and value of new products. This role is an exciting opportunity for a highly motivated R&D Hardware Design Engineer to join the ASIC Packaging, Subsystem, and Integration team. The engineer will be involved in the design and integration of high-performance integrated circuit packaging and subsystem solutions for leading test and measurement products, including Oscilloscopes, Signal Generators, Bit-Error Rate Testers, and Frequency-Domain Instruments. The position is based in Colorado Springs, Colorado, at the base of Pikes Peak. The campus offers office and advanced technology, assembly & machining facilities, along with recreational amenities like a disc golf course, sports courts, a fitness center, and a cafeteria. Colorado Springs is recognized as one of the best places to live in the U.S., offering abundant outdoor access, year-round recreation, and over 300 days of sunshine annually.

Requirements

BS or MS degree in Electrical Engineering or equivalent.
Minimum 7+ years of experience (MS and 5 years) in hardware/circuit design, RF/microwave design, high-frequency modeling/optimization, or high-power density design.
Proven experience with semiconductor, packaging, and printed circuit board technologies, associated materials, manufacturing processes, and design methodologies.
Excellent understanding of Electrical Engineering principles, RF/Microwave theory, and high-frequency circuit design methodologies.
Strong knowledge of thermodynamics and thermostructural analysis principles.
Excellent understanding of materials science principles.
Candidates must be local or willing to relocate to Colorado Springs, CO.
This position requires access to certain goods, software, technology, or technical data subject to U.S. export control laws and regulations. Employment for non-U.S. persons is contingent on Keysight’s ability to obtain any required government authorizations.

Nice To Haves

Familiarity with IC design methodologies, processes, and workflows is preferred.

Responsibilities

Design, optimize, and implement ASIC packaging and subsystem solutions that meet test & measurement product functionality, performance, quality, and schedule requirements, collaborating across global teams.
Develop ASIC packages, modules, and subsystems, including layout, integration, SI/PI analysis, and power delivery network design.
Model and optimize high-frequency RF and high-speed digital I/O interconnects.
Collaborate closely with system, IC design, and test teams to develop and define hardware architecture, requirements, functionality, and performance.
Identify appropriate packaging technologies for chip designs and investigate next-generation industry solutions.
Support instrument product development to enable the integration of critical ASIC blocks.
Collaborate with internal and external supply chain manufacturing partners to identify, develop, deploy, and execute new processes.
Collaborate with test & reliability teams in the characterization and qualification of each ASIC.
Provide lifecycle support for existing ASIC components.