R&D Hardware Architect

Keysight Technologies, Inc.•Colorado Springs, CO

7h•Onsite

About The Position

Keysight is a leader in technology innovation, providing solutions in electronic design, simulation, prototyping, test, manufacturing, and optimization across various markets. With approximately 16,800 employees, Keysight serves customers in over 100 countries. The company fosters an award-winning culture that encourages creativity and innovation. A key to Keysight's success is the development of breakthrough digital, analog, and mixed-signal ASICs, modules, and subsystems. This role is for a highly motivated R&D Hardware Design Architect to join the ASIC Packaging, Subsystem, and Integration team. The architect will lead the development of high-performance test and measurement products such as Oscilloscopes, Signal Generators, Bit-Error Rate Testers, and Frequency-Domain Instruments. This position is part of Keysight Laboratories, located in Colorado Springs, Colorado, and involves collaboration across global teams to design, optimize, and implement subsystem solutions meeting product requirements for functionality, performance, quality, and schedule.

Requirements

BS, MS, or PhD in Electrical Engineering or a related field.
7+ years of experience in system architecture, subsystem design, hardware development, RF/microwave design, high-speed interconnects, advanced packaging, or closely related disciplines, with demonstrated ownership of complex technical solutions.
Expert-level understanding of system and subsystem architecture principles, including requirements decomposition, interface definition, performance budgeting, tradeoff analysis, and cross-domain integration.
Deep experience with semiconductor, package, module, and printed circuit board technologies, associated materials, manufacturing processes, and design methodologies.
Strong expertise in RF/microwave theory, high-frequency circuit design, signal integrity, power integrity, and high-speed modeling and optimization.
Strong foundation in thermal, mechanical, and materials considerations relevant to high-performance and high-power-density subsystem design.
Demonstrated ability to lead technical direction across cross-functional teams and to influence architecture decisions across system, IC, package, board, test, and manufacturing organizations.
Experience defining subsystem requirements, architecture specifications, integration strategies, and validation approaches for complex product developments.

Nice To Haves

Familiarity with IC design methodologies, processes, and workflows is preferred.

Responsibilities

Lead system and subsystem architecture development for advanced instrument platforms, defining partitioning, interfaces, performance budgets, and integration strategies across ASICs, FPGAs, analog/RF circuitry, power delivery, clocking, thermal, mechanical, and signal integrity domains.
Own architecture tradeoff analysis and technical decision-making across performance, cost, manufacturability, reliability, schedule, and risk to deliver differentiated subsystem solutions.
Translate product and technology objectives into subsystem requirements, top-level specifications, interface definitions, and validation plans that align cross-functional development teams.
Drive cross-functional technical alignment across system, IC, package, PCB, firmware, software, test, reliability, and manufacturing teams from concept through production release.
Model, analyze, and optimize high-frequency RF, microwave, and high-speed digital interconnects, including package, substrate, board, and module-level effects.
Guide integration of critical ASIC and subsystem technologies into instrument products, ensuring functionality, performance, quality, and schedule objectives are achieved.
Evaluate and select appropriate packaging, interconnect, and subsystem technologies for each design, while identifying and maturing next-generation solutions for future product roadmaps.
Partner with internal and external manufacturing and supply chain teams to develop scalable implementation approaches, qualification strategies, and deployment plans for new technologies and processes.
Collaborate with test and reliability teams to define characterization strategies, qualification requirements, failure analysis approaches, and lifecycle support plans for new and existing components.
Serve as the senior technical contributor and architectural authority for subsystem integration, mentoring others and influencing design methodology, best practices, and long-term technical direction.