Quantum Topological Qubit Lead Integrator

GlobalFoundries•Essex, VT

8d•$143,000 - $247,000

About The Position

The Topological Qubit Lead Integrator is a senior technical and organizational leadership role within the Quantum Technology Solutions organization. This role is responsible for integrating the semiconductor building blocks required for scalable topological qubit platforms, spanning advanced materials, device architectures, BEOL integration, and heterogeneous assembly. The position combines deep technical leadership with program execution, guiding multidisciplinary teams to translate emerging topological quantum technologies into manufacturable, scalable hardware solutions. The Topological Qubit Lead Integrator owns the end-to-end semiconductor integration strategy for topological qubit systems. This includes aligning advanced materials (III‑V heterostructures, superconductors, and topological materials), device architectures, BEOL interconnect technologies, and 3D heterogeneous integration into manufacturable and qualified platforms. As a Senior Manager / Deputy Director, this role defines integration architectures, sets technical direction, and drives cross-functional execution across device engineering, process development, packaging, and design enablement teams to deliver high-performance, scalable quantum hardware.

Requirements

MS or PhD in Electrical Engineering, Physics, Materials Science, Applied Physics, or related field
12+ years of experience in semiconductor device, materials, or integration
Strong knowledge of quantum-relevant materials (III‑V semiconductors, superconductors, topological materials)
Experience with device physics and operation at cryogenic temperatures
Proven experience leading cross-functional engineering programs
Strong analytical, problem-solving, and communication skills

Nice To Haves

PhD with experience transitioning research into manufacturable semiconductor technologies
Experience with epitaxial growth (MBE, MOCVD) and heterostructure engineering
Background in semiconductor-superconductor or topological/Majorana qubit systems
Experience with BEOL integration, superconducting wiring, or low-loss interconnect
Experience with 3D heterogeneous integration and advanced packaging
Familiarity with cryogenic control/read-out IC architectures
Experience collaborating with academic, government, or industry research programs

Responsibilities

Lead integration strategy for topological qubit platforms across materials, devices, interconnect, and system integration
Define integration architectures combining topological, superconducting, and semiconductor technologies into scalable systems
Drive development and integration of advanced materials, including III‑V heterostructures, epitaxy, and superconducting films
Establish integration schemes for superconducting interconnects and BEOL wiring for low-loss cryogenic operation
Lead integration of qubit devices and associated cryogenic control/read-out ICs
Ensure alignment between device physics (coherence, noise, thermal behavior) and process capabilities
Drive yield learning, variability reduction, and defectivity improvement using DOEs
Define system-level tradeoffs across performance, yield, scalability, and cost
Establish technical milestones, integration checkpoints, and key performance metrics
Support hardware qualification, reliability, and manufacturability readiness
Serve as primary technical interface to internal leadership, external partners, and research collaborators
Communicate progress, risks, and mitigation strategies to executive stakeholders
Build and lead a high-performance team, fostering technical rigor and innovation
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.