As a world's leading chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art. From semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly advanced die prep and packaging. Employees in Intel Foundry are part of a worldwide network of manufacturing, advanced packaging, and assembly/test facilities. As a Quality and Reliability Engineer (QRE), you will be part of FQRL (Foundry Quality, Reliability, and Labs), Intel's Quality and Reliability organization. We are strong believers in partnership, collaboration and teamwork. You will routinely work with the fab module engineers, process integration and worldwide employees both internal and external to Intel. This is an on-site role that requires living in Oregon. This role requires evening meetings most work days. The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly. In addition to traditional product types, we drive Intel's advanced packaging strategy - bringing compelling capabilities to market and enabling large-scale AI computing. C4 (bumping) QREs cover several critical process segments such as interposer, micro-logical, and package side bumping in the WPM organization.
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Job Type
Full-time
Career Level
Entry Level