: Program Manager – Advanced Packaging (E4)
About The Position
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or equivalent
- Minimum 5 years of program management experience in a customer-facing role
- Proven track record of successfully driving technical programs with external customers
- Strong understanding of advanced semiconductor packaging technologies across logic, DRAM, and NAND
- Excellent communication and presentation skills
- Ability to clearly articulate complex technical concepts and value propositions
- Strong organizational and project management skills
- Demonstrated ability to manage multiple priorities in a dynamic environment
- Self-starter with the ability to work independently with minimal supervision
- Collaborative team player with strong cross-functional and global coordination skills
Responsibilities
- Lead end-to-end customer programs, including technical alignment, schedule execution, and resource coordination
- Serve as the primary interface between IMS, internal business units, and external customers
- Drive proactive communication and issue resolution to ensure program success
- Manage complex, multi-disciplinary programs across global teams
- Own program timelines, milestones, risk management, and deliverables
- Ensure alignment across IMS, business units, BD and customer accounts teams
- Apply in-depth knowledge of advanced packaging inflections including: Logic (2.5D/3D integration, chiplets, hybrid bonding), DRAM (HBM, TSV-based integration), NAND (3D NAND scaling and packaging trends)
- Translate customer needs into IMS solution strategies
- Clearly communicate and position IMS value propositions to: Internal Applied Materials business units, External customers and partners
- Support business growth through technical storytelling and solution alignment
- Work seamlessly with globally distributed teams across engineering, sales, and operations
- Foster a collaborative, high-performance team environment
Benefits
- Supportive work culture that encourages you to learn, develop, and grow your career
- Programs and support that encourage personal and professional growth
- Comprehensive benefits package
- Participation in a bonus and a stock award program, as applicable
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
