Advanced Packaging Development Engineer
Broadcom•Irvine, CA
•$127,100 - $203,400
About The Position
Broadcom is a leading semiconductor company with rapid growing business in the AI accelerator and networking chips. We are hiring a talent to develop and enable advanced packaging technology to integrate memory dies and SoC dies into one package for AI related products. Key job scope includes - packaging technology roadmap future product needs for 3-5 years - support development of key components (HBM, iVR, Si Cap) for advanced packaging - manage reliability test to qualify new technology - lead yield improvement activities for new technology ramp-up
Requirements
- Intensive experience in related area such as 2.5D/3D and HBM technology development and reliability/yield improvements.
- Project management skills.
- Team work skills.
- Strength in technology innovation, development, and enablement.
- M.S. degree in related engineering field with at least 10 years (post degree) of direct experience (or 7 years with a Ph.D. degree).
Responsibilities
- Develop and enable advanced packaging technology to integrate memory dies and SoC dies into one package for AI related products.
- Define packaging technology roadmap for future product needs for 3-5 years.
- Support development of key components (HBM, iVR, Si Cap) for advanced packaging.
- Manage reliability tests to qualify new technology.
- Lead yield improvement activities for new technology ramp-up.
Benefits
- Medical, dental and vision plans
- 401(K) participation including company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- Company paid holidays
- Paid sick leave
- Vacation time
- Paid Family Leave
- Other leaves of absence
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What This Job Offers
Job Type
Full-time
Career Level
Senior
