Advanced Packaging Photolithography Development Engineer

Intel Corporation•Hillsboro, OR

1d•$133,800 - $188,890•Onsite

About The Position

We are seeking a highly skilled and motivated Lithography Process Development Engineer to join our Advanced Packaging Technology Development team. In this role, you will be driving lithography process development at the forefront of next-generation semiconductor packaging technology, including hybrid bonding applications. You will work in a dynamic, cross-functional environment collaborating with process integration, equipment, metrology, and design teams to enable industry-leading interconnect density and yield.

Requirements

Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or related fields with 3+ years of relevant experience
PhD degree in the same fields with 2+ years of relevant experience
Hands-on lithography process development experience with i-line, KrF or ArF lithography process development in a semiconductor fab
Hands-on experience with photoresist process development, including coat/bake/develop optimization, resist profile engineering, and process window characterization
Strong understanding of optical lithography fundamentals: aerial image formation, resist chemistry, focus-exposure matrix (FEM), depth of focus (DOF), and exposure latitude (EL)
Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

Nice To Haves

Strong analytical and problem-solving skills with ability to perform systematic root cause analysis on complex, multi-variable process issues
Experience with packaging processes, equipment automation development, or project management in technology development.
Experience in advanced packaging lithography environments (Foveros, Foveros Direct, fan-out WLP, 2.5D/3D IC, CoWoS, SoIC, or equivalent)
Experience with overlay metrology and control, and familiarity with CDSEM and OCD/scatterometry for process monitoring and control

Responsibilities

Qualify scanner/stepper platforms and Track system for backend and hybrid bonding lithography applications
Develop, characterize, and optimize photolithography processes for back-end applications, including Cu damascene pad patterning, dielectric via and trench lithography, bonding interface layer patterning, and alignment mark / overlay design and optimization
Evaluate and implement underlayer stacks to address topography challenges inherent in far backend and packaging substrates
Develop and optimize overlay metrology and control strategies critical for advanced packaging nodes
Implement advanced process control (APC) including run-to-run (R2R) and lot-to-lot overlay feedback/feedforward control loops
Work closely with integration and other modules to develop fully integrated process flows, ensuring lithography compatibility with upstream and downstream process steps
Support yield learning by performing systematic defect analysis, root cause investigation, and implementing corrective actions for lithography-related yield detractors
Contribute to technology roadmap planning for next-generation node and engage with equipment and material suppliers to evaluate next-generation tools and materials