About The Position

Amphenol High Speed Products Group is seeking a Product Development Engineer to design and develop high-speed IO connectors. The role is located in Etters, Pennsylvania, and focuses on connectivity solutions for next-generation AI/ML platforms and high-bandwidth data center applications. The engineer will serve as the technical owner for a specific form factor, driving innovation, customer engagement, and cross-functional execution. The position leads connector concept generation, design, qualification, testing, and validation for 112Gb+ signaling. It also manages development projects from concept through production, supports new product introduction and manufacturing transitions, and serves as the primary technical interface for customers. The work involves collaboration with engineering, manufacturing, quality, internal laboratories, external partners, and global customer teams. Amphenol describes itself as an excellent employer focused on supporting employees and customers and offering career growth within a global organization. The company states that employees at every level can positively impact the business and that it is an equal opportunity employer.

Requirements

  • Bachelor's or Master's degree in Mechanical or Electrical Engineering.
  • At least 5 years of experience in connector or high-speed product development.
  • Proficiency with CAD tools such as SolidWorks or Creo and simulation software such as ANSYS.
  • Strong understanding of signal integrity, EMI/EMC, and thermal management.
  • Experience with materials and manufacturing processes including stamping, plating, molding, and assembly.
  • Excellent communication skills with global teams and customers.
  • Ability to manage multiple projects and prioritize effectively.

Responsibilities

  • Lead concept generation, design, and qualification of high-speed IO connectors for 112Gb+ signaling.
  • Develop connectors for AI/ML workloads, emphasizing signal integrity, mechanical robustness, and thermal efficiency.
  • Apply advanced design techniques for low latency, high-density packaging, and manufacturability.
  • Collaborate with cross-functional teams on system-level integration and compliance with industry standards such as OSFP, QSFP-DD, and PCIe.
  • Define and execute testing protocols for electrical, mechanical, and environmental performance.
  • Perform Design FMEA, tolerance analysis, design for manufacturability (DFM), finite element analysis (FEA), and risk analysis.
  • Work with internal laboratories and external partners to validate performance in real-world environments.
  • Manage development projects from concept through production, including timelines, deliverables, and cross-functional coordination.
  • Maintain clear documentation and communication across engineering, manufacturing, and quality teams.
  • Support new product introduction (NPI) and transition to manufacturing.
  • Act as the primary technical interface for customer engagements.
  • Translate customer requirements into design goals and support design reviews, prototyping, and field validation.
  • Present product concepts early in the development cycle and incorporate feedback into design iterations.

Benefits

  • Career growth within a global organization
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