Process Integration Engineer (R&D)

Texas Instruments•Lehi, UT

1d•Onsite

About The Position

Texas Instruments is seeking an experienced engineer to support process technology development for its embedded and analog businesses. The role focuses on developing 28nm and 22nm process technologies at a growing 300mm analog and embedded wafer fab in Lehi, Utah. The engineer applies semiconductor device physics and model-based problem solving to resolve integration issues and improve parametric performance and yield. They support development of process-flow sections by helping define requirements, specifications, and technical success criteria, and drive process and device improvements through characterization, testing, design of experiments (DOE), data analysis, and simulation. Working with experienced engineers, the role applies process-integration best-known methods for advanced CMOS nodes below 28nm. The position partners with process, integration, reliability, packaging, and test engineering teams to achieve program goals, and works with product groups to optimize process performance against critical device parameters and enable differentiated products. The successful candidate plans and manages concurrent technical tasks, meets deadlines, contributes to technical discussions, communicates project status and actions clearly, works across organizational boundaries, and collaborates effectively with a diverse team.

Requirements

Master’s degree in Electrical Engineering, Electrical and Computer Engineering, or a semiconductor-focused discipline such as solid-state physics, applied physics, or a related field.
At least 3 years of experience working in a semiconductor factory environment, including advanced CMOS technology development; HKMG expertise is preferred, for technology nodes below 28nm.
Demonstrated strength in DOE and data analysis, and in translating learning into process and parametric improvements.
Ability to plan and manage multiple technical tasks in parallel and meet critical deadlines.
Ability to contribute to technical discussions, clearly communicate project status and actions, interface effectively with multiple organizations, and work effectively on a diverse team.

Nice To Haves

HKMG expertise in advanced CMOS technology development for technology nodes below 28nm.
Ability to build strong working relationships with key internal and external stakeholders.
Strong technical communication and cross-functional technical leadership skills.
Ability to ramp quickly on new systems, tools, and processes.
Strong interpersonal, analytical, and problem-solving skills.
Proven ability to collaborate effectively across functions and within diverse teams.
High ownership mindset, initiative, and drive for results.
Strong time-management and prioritization skills, with a track record of on-time project delivery.

Responsibilities

Apply semiconductor device physics and model-based problem solving to resolve complex integration issues and support parametric and yield improvements.
Support development of process-flow sections by helping define process requirements, specifications, and technical success criteria.
Drive process and device improvements through characterization, testing, design of experiments (DOE), data analysis, and simulation.
Work with experienced engineers to apply process-integration best-known methods for advanced CMOS technology nodes below 28nm.
Partner with process, integration, reliability, packaging, and test engineering teams to deliver program goals.
Work closely with product groups to optimize process performance to meet critical final device parameters and enable differentiated products.
Plan effectively, manage multiple technical tasks in parallel, and meet critical deadlines.
Contribute to technical discussions, communicate project status and actions, and work effectively across organizational boundaries and diverse teams.