Senior Process Integration Engineer
About The Position
Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. We are seeking a highly organized and detail‑oriented Process Integration Engineer to support Manufacturing Operations by optimizing and transferring existing 0.18um Mixed Signal and BCD manufacturing processes, driving cross‑functional teams to resolve technical issues, and interfacing with internal and external customers. This role includes ownership of analog/mixed‑signal device processing, parametric testing, and defect analysis for legacy and new technology products.
Requirements
- 5+ years experience as a semiconductor Process Engineer or Process Integration Engineer.
- Master’s degree or above in Electrical Engineering.
- Strong technical foundation in wafer fabrication processes, including: Photolithography Chemical Mechanical Polishing (CMP) Diffusion Chemical Vapor Deposition (CVD) Wet and dry etch Rapid Thermal Annealing (RTA) Ion implantation Epitaxial growth Metallization
- Demonstrated knowledge of semiconductor device physics, particularly CMOS and BJT technologies.
- Strong communication skills with the ability to remain composed, clear, and effective in challenging or diverse situations.
- Working knowledge of statistical process control (SPC) and applied statistics.
- Strong attention to detail with proven root‑cause analysis capability.
- Basic familiarity with failure analysis methodologies.
Nice To Haves
- Experience with foundry tape‑out flows (TSMC or similar).
- Experience with foundry NPI, including troubleshooting tape‑out and process‑transfer issues.
- Background in IC wafer fabrication engineering, semiconductor materials, manufacturing systems, and wafer electrical test.
Responsibilities
- Provide technical ownership of BiCMOS and BJT‑focused manufacturing process flows, including transferring processes from foundry to internal manufacturing site
- Execute and support tape‑out activities for transferring legacy and new semiconductor products into the Beaverton fab.
- Review and interpret source GDS, mask lists, MT‑form data, and validate against internal process flows and PDK structures.
- Ensure correct layer generation, scribe selection, die‑size matching, test‑line placement, and alignment with established flow requirements.
- Identify when new modules, process options, or flow changes are needed and work with cross‑functional integration teams to develop and enable them.
- Lead engineering teams to investigate and resolve yield, defect, and parametric performance issues.
- Optimize manufacturing processes through design of experiments (DOE) and systematic data analysis.
- Evaluate and disposition wafers and lots based on electrical test results and inline parametric data.
- Drive Corrective and Preventative Actions (8D processes) to address root cause and prevent recurrence.
- Serve as a technical interface between Process Integration, Module Engineering, Manufacturing, Quality, and external foundries.
- Communicate clearly and effectively in high‑visibility situations with executive management, key customers, and auditors.
Benefits
- medical, vision and dental coverage
- 401k
- paid vacation, holidays, and sick time
- discretionary performance-based bonus
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What This Job Offers
Job Type
Full-time
Career Level
Senior
