Senior Principal Semiconductor Equipment & Process Integration Engineer

RTX•Andover, MA

20h•$132,400 - $251,600•Onsite

About The Position

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. Raytheon has an exciting opportunity for a Sr. Principal Semiconductor Equipment & Process Integration Engineer to join our III-V process development team within the RF Microelectronics/Module Design & Foundry Services (RFMicro) Department. In this role, you will work on cutting-edge gallium arsenide, gallium nitride-based devices, and III-V focal plane array fabrication. We are seeking a highly skilled professional with a broad understanding of microelectronics processing and equipment, particularly in areas such as deposition, etch, photolithography, metrology, and process characterization, with expertise in at least one of these areas. As an Equipment and Process Integration Engineer, you will collaborate across engineering work centers in our III-V semiconductor wafer foundry to manage the complete lifecycle of tool acquisitions—from planning through installation and sustainment. You will lead and assist project teams with capital allocation, vendor coordination, equipment engineering, and facilities support to ensure seamless tool installations and process qualifications are completed on schedule. You will also monitor progress, report on milestones, and drive foundry improvements. The ideal candidate is an innovative problem-solver with a demonstrated ability to think critically and creatively, both independently and in team settings. A strong background in microelectronics processing techniques, such as data analysis, foundry process integration, and process characterization, is essential. The candidate is expected to work well in large and small, cross-functional teams, understand foundry processes, determine process limitations, improve overall equipment effectiveness, identify throughput improvement opportunities, gather sponsorship and team resources, and execute activities. Presence on the foundry floor is essential for quick resolution of technical issues. This 1st shift role will be 100% on-site and based in Andover, MA.

Requirements

Typically requires a Bachelor’s degree in Science, Technology, Engineering or Mathematics (STEM) or an Advanced Degree in a related field and minimum 5 years’ of prior work experience.
A minimum of 8 years’ of work experience in semiconductor processing techniques and capital equipment including photolithography, dry etching, wet chemistry, metals evaporation, sputtering and backside processing.
The ability to obtain and maintain a U.S. government issued security clearance post-start is required.
U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.

Nice To Haves

Experience managing and reporting on projects.
Proven ability to lead cross-functional teams and execute improvement initiatives.
Excellent communication and coordination skills
Familiarity with III-V semiconductor fabrication processes and techniques.
Experience troubleshooting a wide range of fabrication equipment in addition to establishing equipment qualification and preventative maintenance procedures.
Strong analytical and data-driven approach to problem-solving.
Proficient in statistical process control and lean manufacturing methods (e.g., Six Sigma).
Experience in a data analysis software package (e.g., FabGuard, SQL, JMP).

Responsibilities

Lead, manage, and support projects throughout the capital equipment lifecycle, including source selection, acquisition, facilities infrastructure, installation, qualification, sustainment, and troubleshooting.
Develop a capital roadmap to identify and implement process and equipment capabilities that enhance wafer capacity, product yield, and next-generation technology development.
Drive initiatives in capital acquisition, process optimization, yield enhancement, rework reduction, equipment cost of ownership, and process development.
Create and maintain schedules for tool and process qualifications while addressing capacity constraints and identifying opportunities for improvement.
Collaborate with cross-functional teams to understand foundry processes, identify limitations, and improve overall equipment effectiveness and throughput.
Conduct statistical analysis and manipulate large datasets to define SPC (Statistical Process Control) metrics, correlate equipment input parameters with process outputs, and improve yield, cycle time, process capability, and equipment uptime.
Frequently work directly on the foundry floor to resolve technical issues and interface with teams from operations, facilities, environmental health and safety (EHS), equipment, and quality.