Process Integration Development Engineer

Intel Corporation•Hillsboro, OR

3d•$115,110 - $219,550•Onsite

About The Position

At Intel, we are at the forefront of innovation, creating world-changing technology that enriches the lives of every person on planet. The Foundry labs directly support advancement of Intel's technology development. The transmission electron microscopy group supports engineering activities in fabrication, failure analysis, technology development, process development, process integration, and pathfinding. Our job is to understand where our manufacturing process and metrologies need to be improved. We are looking for engineers who love solving technical problems, are driven to achieve results, and are flexible in adapting to new methods, tools, and fields of study depending on what is needed to solve the problem at hand. The position will involve characterizing semiconductor nano-devices using advanced transmission electron microscopy (TEM) to expand analytical capabilities. The Time-To-Information-Return (TTIR) of this imaging analysis is critical to TD as we advance process nodes and require revolutionary changes in our support structure and methodologies. We are embarking on those changes. The position is responsible for imaging TEM samples and performing analysis including strain, 4D STEM, EELS and EDX. The Engineer will be responsible for but not limited to: Technical functions in support of engineering activities such as fabrication, failure analysis, technology development, process development, and process integration. Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues. Conducts engineering tasks and detailed technical procedures to perform sample preparation or imaging using advanced focused-ion-beam and/or transmission electron microscope tools in support of the research and development activities of Intel. Contributes to continuous improvement efforts in high volume manufacturing environments. Performs other related duties as required or as directed. Continuous upgrading of skill set; requires an open attitude and skills to learn from.

Requirements

PhD degree in a Technical Area (Materials Science, Chemistry, Physics or related field of study)
Hands-on experience with Transmission Electron Microscopy (TEM) operation.

Nice To Haves

Experience with Python scripting or MATLAB or other programming languages
Hands-on Experience with TEM sample imaging with automation
Hands-on Experience with Advanced Transmission Electron Microscopy, such as EELS, EDX and/or 4D STEM
Knowledge of semiconductor process integration

Responsibilities

Technical functions in support of engineering activities such as fabrication, failure analysis, technology development, process development, and process integration.
Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues.
Conducts engineering tasks and detailed technical procedures to perform sample preparation or imaging using advanced focused-ion-beam and/or transmission electron microscope tools in support of the research and development activities of Intel.
Contributes to continuous improvement efforts in high volume manufacturing environments.
Performs other related duties as required or as directed.
Continuous upgrading of skill set; requires an open attitude and skills to learn from.