Process Engineering Manager

Halo Industries•Santa Clara, CA

2d•Onsite

About The Position

The Company Halo Industries has developed breakthrough technology to revolutionize a decades-old semiconductor material slicing process. Our laser-based solution minimizes waste, enhances material cost efficiency, and drives innovations across high-growth markets, including automotive, telecommunications, and power electronics. Founded in 2014 at Stanford University, Halo received significant funding in 2024, paving the way for rapid expansion, strategic customer engagement, and the launch of volume manufacturing. The Opportunity As the Process Engineering Manager at Halo Industries, you will stand at the center of a manufacturing revolution. We aren’t just making wafers; we are fundamentally redefining silicon carbide wafering to power the future of electric vehicles, renewable energy, data centers, and more. Reporting to the Director of Manufacturing, you will lead our process engineering team through its most critical evolution: transitioning from a high-potential pilot line to a world-class, high-volume manufacturing (HVM) facility. This is a "builder" role designed for a leader who thrives on the intersection of novel laser processing and rigorous operational discipline. You will be responsible for taking our proprietary laser-based slicing technology and stabilizing it for 24/7 volume production with industry leading yield, throughput, and cost-efficiency. Why this role matters: Scale the Future : You will bridge the gap between R&D innovation and manufacturing excellence, turning complex laser-material interactions into a repeatable, automated production engine. Drive the Bottom Line : Success is measured by metrics that matter—dramatically reducing rework, maximizing yield, and lowering the total cost of ownership for SiC substrates. Lead a Culture of Excellence : You will mentor a multidisciplinary team of engineers, instilling a data-driven culture rooted in Statistical Process Control (SPC) and Lean principles. If you are a semiconductor veteran who is tired of incremental improvements and wants to lead a generational shift in manufacturing within a fast paced startup, this is your opportunity to leave a legacy.

Requirements

BS/MS in Chemical, Mechanical, Manufacturing, Industrial Engineering, or related field.
10+ years in semiconductor manufacturing, with 3+ years managing engineering teams through a significant production scale-up (Pilot to HVM).
Direct experience with Silicon Carbide (SiC), Gallium Nitride (GaN), or related device manufacturing is highly desired due to its unique material challenges optimizing process capability.
Expert knowledge of wafering processes, specifically laser slicing/dicing, grinding, polishing (CMP), and advanced metrology used in the SiC and semiconductor industry.
Proficiency to lead Root Cause Analysis (RCA) and Failure Mode and Effects Analysis (FMEA) to solve complex process capability, rework, and yield limiters.
Experienced in leveraging commercial MES, ERP, and automation systems to optimize the value of our data through action in a 24/7 production environment.
Familiarity with IATF 16949 or ISO 9001 standards, specifically for power electronics or automotive supply chains.
Demonstrated capacity to transition a team’s mindset from "R&D Feasibility" to "Process Control & Stability."
Skilled at collaborating with R&D, Applications Engineering, Operations, Quality, and Planning to drive strategic decisions to closure.
Proven competence to distill complex technical data into concise executive summaries and recommendations for improved process capability, increased capacity, reducing cost, and long term strategic global planning.

Nice To Haves

SiC/Compound Semi Background

Responsibilities

Lead our process engineering team through its most critical evolution: transitioning from a high-potential pilot line to a world-class, high-volume manufacturing (HVM) facility.
Take our proprietary laser-based slicing technology and stabilize it for 24/7 volume production with industry leading yield, throughput, and cost-efficiency.
Bridge the gap between R&D innovation and manufacturing excellence, turning complex laser-material interactions into a repeatable, automated production engine.
Drive metrics that matter—dramatically reducing rework, maximizing yield, and lowering the total cost of ownership for SiC substrates.
Mentor a multidisciplinary team of engineers, instilling a data-driven culture rooted in Statistical Process Control (SPC) and Lean principles.
Transition a team’s mindset from "R&D Feasibility" to "Process Control & Stability."
Collaborate with R&D, Applications Engineering, Operations, Quality, and Planning to drive strategic decisions to closure.
Distill complex technical data into concise executive summaries and recommendations for improved process capability, increased capacity, reducing cost, and long term strategic global planning.