Summer 2027 - Process Engineering Intern - PhD
About The Position
In the Office of Chief Technical Officer (OCTO) organization, we are dedicated to excellence in the design and engineering of Lam's next generation photolithography, deposition, and etching products. We drive innovation to ensure our cutting-edge solutions are helping to solve the biggest challenges in the semiconductor industry. Be a part of the exciting Patterning Technology team in Lam Research. Our mission is to innovate WFE (wafer fab equipment) processes and products in the EUV (Extreme Ultra-Violet) Patterning Technology. In this role, you will directly contribute EUV Patterning process development efforts. You will work directly with experienced process development engineers developing novel patterning technologies. Your work will lead to breakthrough in the technologies and products that Lam provides to semiconductor manufacturers worldwide.
Requirements
- Must be a PhD graduate student in Material Science & Engineering, Chemical Engineering, Chemistry, or related majors.
- Understanding of chemical mechanisms in semiconductor wafer processing.
- Hands-on experience in a cleanroom or laboratory setting working with thin films, semiconductor patterning, or solid-state materials.
- Strong writing and verbal communication skills.
- Proficient in PowerPoint to adequately convey project status, experimental plans, and conclusions.
Nice To Haves
- Experience with plasma process of depositing and etching of thin films.
- Understanding of problem-solving and troubleshooting techniques such as DOE, 5-why, 8D, fishbones, etc.
- Have experience working on troubleshooting processing equipment and systems.
- Experience with thin film analytical methods such as SEM/TEM, XPS, AFM, ellipsometry, SIMS.
- Knowledge in lithography, photoresist, EUV patterning
Responsibilities
- Learn to operate semiconductor wafer processing equipment in laboratory and clean-room environments.
- Supports in the testing and characterization on development of new processes. These duties include setting up of and running experiments, operations of wafer process tools in application labs, chemistry and material analysis, and use of metrology tools to measure and characterize on wafer performance.
- Plan and execute concept and feasibility studies of novel EUV patterning technology including thin film deposition processes, etching process, chemistries, and materials.
- Summarize and analyze experimental test data. Discuss and present data and conclusions with cross-functional teams.
- Further R&D support activities ie: sharing literature reviews on relevant research topics.
Benefits
- Outstanding benefits
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What This Job Offers
Career Level
Intern
Education Level
Ph.D. or professional degree
