Process Engineering Intern

MACOM•Lowell, MA

2d•Onsite

About The Position

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks. MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates. Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure! Process Engineering Intern Position Summary: Join our Process Engineering team in Lowell, Massachusetts, for a 12-week internship focused on electroplating within a semiconductor wafer fabrication environment. You will work alongside experienced engineers to optimize plating processes, analyze bath chemistry, characterize plated films, and use experimental data to improve process capability, quality, yield, and operational efficiency.

Requirements

Currently pursuing a bachelor’s or master’s degree in chemical engineering, materials science and engineering, chemistry, or a related technical field
U.S. citizenship or permanent-resident status, as required for ITAR-controlled work
Willingness and ability to work in a semiconductor cleanroom and follow applicable safety, gowning, and chemical-handling procedures
Ability to plan experiments, troubleshoot technical problems, analyze data, and communicate findings clearly
Ability to work independently and collaboratively in a manufacturing environment

Nice To Haves

Coursework, laboratory experience, or research involving electrochemistry, electroplating, chemical analysis, or materials characterization
Exposure to semiconductor manufacturing, microfabrication, or cleanroom processing
Experience with design of experiments, statistical analysis, or data visualization
Familiar with JMP, SQL, Excel, or similar data-analysis tools

Responsibilities

Backside-via plating optimization: Plan and execute experiments to evaluate plating performance, identify key process variables, characterize thickness and deposit quality, and determine process improvements
In-house plating-chemistry analysis platform: Help develop and validate practical analytical methods for monitoring plating-bath composition and condition, with the goal of improving process control and enhancing in-house analytical capabilities.
Data analysis and communication: Organize and analyze experimental results, document methods and conclusions, and present findings to engineering and manufacturing stakeholders.