The Advanced Electronics and Photonics Core Facility seeks a qualified candidate for a principal process engineering position. The candidate will mainly be focused on a key component of a fanout wafer-level packaging process which will likely include photolithography or panelization (pick and place, wafer molding, wafer dicing, and wafer grinding). Primary areas of responsibility will include process development on our 300mm wafer packaging toolsets as well as equipment ownership of selected tools. As part of a multi-disciplinary team, you will interact with individuals responsible for areas such as device physics, deposition, etching, photolithography, and electrical test to ensure robust wafer packaging processes that meet the precise physical and electrical requirements for our customers. In addition, you will serve as the process engineering lead for the wafer prep and finishing area. As part of the AEP Core operations team, you will support operations and increase equipment up time, respond to production issues, implement solutions, reduce costs, and improve yields. In this position, you will support existing processes, develop new processes, identify process and material improvements, and develop intellectual property. You will also use statistical process controls and data analysis to support and monitor the performance of the equipment. Customer service is an integral part of the principal process engineer position. The candidate will be interacting directly with a wide variety of students, faculty, and other professionals to provide services as requested. Skill in communicating technical ideas in a positive and patient manner is a must. This position is funded by DoD and requires candidates to meet the definition of US person as defined in as defined by 22 C.F.R. § 120.62 and 15 C.F.R. § 772.1.
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Job Type
Full-time
Career Level
Principal