Process Development Engineer
About The Position
Teledyne Microwave Solutions is seeking a Process Development Engineer to support and develop advanced manufacturing processes for sophisticated microwave/RF components and integrated assemblies used in aerospace, defense, and communications applications. The position supports thin-film hybrid assembly and MIC processes, including eutectic and epoxy attach, bond pull, gap welding, sealing, and painting. The engineer troubleshoots assembly processes, investigates in-process technical issues, and contributes to process development and continuous improvement. The role also supports new product development, especially auto wire-bonding and die attach; generates engineering change orders and maintains assembly documentation; leads process transfers from NPI to production; and designs tooling using CAD software. Production data analysis and implementation of solutions using Lean, PFMEA, and SPC methodologies are also part of the position. Candidates need a bachelor's degree in engineering or equivalent and at least one year of experience in electronics manufacturing. Familiarity with electronics assembly, tooling design, quality standards, and lean manufacturing is relevant to the work. Applicants must be U.S. citizens and able to obtain and maintain a government security clearance. The anticipated salary range is $58,700 to $78,300; actual compensation depends on several factors, including location, education, experience, and skills.
Requirements
- Bachelor’s degree in engineering or equivalent.
- At least 1 year of experience in electronics manufacturing.
- Familiarity with AS9100/ISO9001 standards and lean manufacturing principles.
- Proficiency in Microsoft Office.
- Strong analytical, problem-solving, and communication skills.
- Must be a U.S. citizen and able to obtain and maintain a government security clearance.
Nice To Haves
- Background in electronics assembly processes such as wire bonding and die attach.
- Knowledge of process tooling design and application.
- SolidWorks experience.
Responsibilities
- Provide process engineering support for thin-film hybrid assembly and MIC processes.
- Support assembly methods including eutectic attach, epoxy attach, bond pull, gap welding, sealing, and painting.
- Troubleshoot new assembly processes and resolve in-process technical issues using root cause analysis.
- Participate in process development, research, and continuous improvement initiatives.
- Generate ECOs and maintain accurate assembly documentation.
- Assist in new product development, with emphasis on auto wire-bonding and die attach.
- Lead process transfers from NPI to production and design tooling using CAD software.
- Analyze production data and implement solutions using Lean, PFMEA, and SPC methodologies.
Benefits
- Competitive pay and comprehensive health benefits.
- 401(k) with company match and retirement plans.
- Paid time off and flexible work arrangements.
- Professional development and training opportunities.
- Employee wellness programs and assistance resources.
- Collaborative environment working on mission-critical technology.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
What This Job Offers
Job Type
Full-time
Career Level
Entry Level
