Process and Integration Engineer, Optoelectronics

Broadcom•Breinigsville, PA

1d•$109,700 - $175,500•Onsite

About The Position

We are seeking a highly skilled Process Integration Engineer to join our Optical Systems Division. This position is pivotal to the efficient and profitable manufacturing of microelectronic laser and detector products. In this 100% on-site position in our fast-paced, 24/7 manufacturing environment, the successful candidate will serve as the technical authority for the facet coating process, driving improvements in productivity, yield, quality, and reliability across both internal operations and subcontractor facilities and will collaborate cross-functionally to ensure operational excellence and meet critical production commitments.

Requirements

Master’s degree in Materials Science, or Optical, Chemical, or Electrical Engineering.
Minimum of 6 years of experience in semiconductor manufacturing, with at least 4 years of hands-on experience in thin-film deposition, specifically for optoelectronic devices.
Solid understanding of vacuum physics and deposition techniques (IBS, ALD) and dielectric coating materials (e.g., Al2O3, SiO2, Ta2O5, TiO2, Si3N4).
Strong background in statistical data analysis; proficiency with SPC, DOE, FMEA, DMAIC, and advanced tools such as JMP, SQL, and Tableau.
Experience with automated bar-handling, wafer scribing and cleaving, Pick-and-Place (PnP), AVI tools, Burn-in, and mechanical engineering fundamentals.
Excellent written and verbal communication, detail-oriented problem-solving capabilities, and a proactive, action-oriented mindset.

Nice To Haves

Ph.D. in Materials Science, or Optical, Chemical, or Electrical Engineering with at least 3 years of experience in semiconductor manufacturing.
Proven knowledge and practical application of Lean manufacturing methodologies.

Responsibilities

Lead the development, optimization, and scaling of complex multilayer coatings (AR, HR, and passivation layers) using Ion Beam Sputtering (IBS).
Design and execute experiments (DOE) to improve manufacturing efficiency and optimize batch processes.
Serve as the technical lead for facet coating and backend operations, including wafer scribing, laser bar handling, and Automated Visual Inspection (AVI).
Manage equipment lifecycles, from defining requirements for new tool acquisitions to leading the qualification and buyoff of engineering upgrades.
Implement robust process control plans, SPC, FMEA, and OCAP.
Utilize spectroscopic ellipsometry, spectrophotometry, and AFM for metrology.
Conduct deep-dive root cause analyses and implement corrective and preventive actions (CAPA) to mitigate defects and process excursions.
Partner with internal Product, Quality, and R&D teams, as well as external foundries, to align technical goals.
Manage subcontractor performance across regions via remote monitoring and maintain standard operating procedures (SOPs) and technical documentation.
Establish KPIs and dashboards to monitor daily performance, cycle times, and process health; communicate findings through periodic report to management.