Process and Integration Engineer

Keysight Technologies, Inc.•Santa Rosa, CA

1d•Onsite

About The Position

Join Keysight's Microcircuit Assembly R&D team and help develop the advanced manufacturing processes that enable the next generation of electronic test and measurement technologies. In this hands-on engineering role, you'll work alongside experienced engineers to develop innovative manufacturing solutions, solve complex technical challenges, and support New Product Introduction (NPI) activities that transform breakthrough designs into reliable, manufacturable products. Working across materials, mechanical, electrical, and manufacturing disciplines, you'll collaborate with cross-functional teams to bring innovative products from concept into production, helping shape technologies used across communications, aerospace and defense, automotive, semiconductor, and emerging markets.

Requirements

Bachelor's in Materials Science, Mechanical Engineering, Chemical Engineering, Physics, Manufacturing Engineering, Electrical Engineering, or a related engineering discipline.
Typically 2-4 years of relevant experience, or an equivalent combination of education and experience.
Hands-on experience with manufacturing process development, process optimization, DOE, or technical problem solving in a manufacturing or R&D environment.
Strong analytical and problem-solving skills with the ability to interpret experimental data and identify process improvements.
Experience collaborating with cross-functional engineering and manufacturing teams.
Strong written and verbal communication skills with the ability to document technical work clearly and effectively.
Ability to work in a hands-on laboratory environment supporting process development and product integration.
ITAR clearance

Nice To Haves

Master’s degree preferred.
Experience with microelectronics, microcircuit assembly, semiconductor packaging, or precision manufacturing processes.
Experience with high frequency interconnect and connectorization for RF applications
Experience working in a fast-paced New Product Introduction (NPI) environment.
Experience designing tooling, fixtures, or manufacturing equipment.
Hands-on experience with one or more of the following: Epoxy dispensing, Component placement, Wire bonding, Stud bumping, Flip-chip or thermocompression bonding, Soldering, Plasma cleaning
Experience using statistical analysis tools such as JMP or Minitab.
Experience with CAD software such as Siemens NX or PTC Creo.
Programming or automation experience using Python or similar scripting languages.
Knowledge of Design for Manufacturability (DFM), Design of Experiments (DOE), statistical process control (SPC), or root cause analysis methodologies.

Responsibilities

Participate in Design for Manufacturability (DFM) reviews and collaborate with cross-functional teams (R&D, Manufacturing, Quality) to improve manufacturability and production readiness.
Utilize CAD, statistical analysis software, automation tools, and laboratory equipment to develop, qualify, and optimize advanced microcircuit assembling processes including epoxy dispensing, component placement, gold-gold thermosonic bonding (wire bonding, ball bonding, stud bumping, flip chip), soldering, silver sintering and related manufacturing technologies.
Perform hands-on experimentation, characterization, environmental testing, and troubleshooting to improve product quality, manufacturability, and yield in a fast pace New Product Introduction (NPI) environment
Design and develop tooling, fixtures, and equipment to support assembly, process validation, and product testing.
Create and maintain process documentation, work instructions, engineering reports, and manufacturing specifications.
Contribute to continuous improvement initiatives focused on manufacturing efficiency, product quality, reliability, and process capability.
Stay current with emerging manufacturing technologies and engineering best practices while building technical expertise across materials, mechanical, electrical, and manufacturing disciplines.