About The Position

Vinci is building Physics AI for hardware design. Its software platform helps hardware designers and physics simulation engineers explore, analyze, and optimize hardware systems, combining the accuracy and determinism of traditional simulation with the speed and scaling of AI. As a pivotal leader in the European Forward Deployment team, the Principal Thermal-Mechanical Engineer will drive adoption of Vinci’s platform among leading engineering organizations. The role involves building, mentoring, and guiding a high-performing team of thermal engineers who engage prospective customers and demonstrate the platform’s value. The team will advise enterprise customers on validating and optimizing real-world designs, showing how Vinci’s platform can improve thermal performance, product reliability, and time-to-market. The role calls for deep simulation expertise and strong fundamentals in continuum mechanics, including analysis of linear, geometric, and material nonlinearities and contact interactions. The team will assess warpage, stress evolution, thermal cycling, and reliability across advanced semiconductor devices, electronics packages, and wafer-scale systems. The engineer will work with customer engineering teams to understand technical challenges, provide expert guidance, and communicate Vinci’s capabilities. They will also relay customer insights to product and engineering teams to inform product direction and improvement. This is a remote role with close collaboration with Sales, Product, and Engineering in Palo Alto, California. It includes moderate travel, primarily within continental Europe, and infrequent intercontinental travel may be required for collaboration with the US team.

Requirements

  • Degree in Mechanical Engineering, Electrical Engineering, or a closely related technical field.
  • Expert-level mastery of commercial FEA software such as Ansys Mechanical, Abaqus, or equivalent.
  • 15+ years of hands-on experience in thermo-mechanical simulations, either as a simulation practitioner or as a technical account manager for commercial physics simulation software.
  • Deep familiarity with semiconductor electronics packaging, advanced packaging technologies such as 2.5D/3D IC, or foundry ecosystems.
  • Prior experience in dedicated customer-facing roles and ability to build trust and manage engineering client relationships.
  • Practical programming experience using Python or C++ to automate workflows or parse simulation data.
  • Prior managerial or technical leadership experience, with the ability to scale, mentor, and drive execution across engineering teams.
  • Exceptional interpersonal and communication skills, including the ability to explain complex physics and simulation results to technical audiences and business executives.

Nice To Haves

  • Familiarity with thermal management and cooling solutions and/or Electrical Signal Integrity and Power Integrity (SI/PI) workflows.
  • Direct experience commercializing technical software, ideally EDA or CAE simulation tools, into major semiconductor and electronics enterprises.
  • Experience in technical pre-sales, application engineering (FAE), or strategic technical sales.
  • Ability to adopt and champion next-generation physics-based workflows and AI-assisted design or simulation tools.

Responsibilities

  • Build, lead, and scale a high-performing team of thermo-mechanical engineers; set technical direction, hire and mentor team members, and drive field execution across Europe.
  • Work closely with Sales to lead technical discussions, scope proof-of-concept evaluations, and deliver product demonstrations to prospective enterprise customers.
  • Guide customer engineering teams through evaluation by overseeing simulation setup, running complex test cases, and interpreting results to demonstrate Vinci’s technical and business value.
  • Own customer enablement through onboarding, deployment pipeline, and account expansion, providing senior technical guidance, structured training, and advanced troubleshooting.
  • Identify customer pain points and workflow bottlenecks, and partner with Product and Engineering to turn field feedback into product features.
  • Represent Vinci at major industry conferences and semiconductor events through technical presentations and live platform demonstrations.
  • Maintain an understanding of competitive technologies, industry trends, and market positioning to communicate Vinci’s differentiators.
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